1. The success rate of rework is high
Now the mainstream heating of the rework station has a full infrared, full hot air and two hot air and an infrared. bga rework station heating is generally upper and lower hot air, the bottom of the infrared preheating three temperature zones (two temperature zones of the bga rework station only the upper hot air and the bottom of the preheating, compared to the three-temperature zone is a little behind).
2. Simple operation
Simple upper and lower heating header: heated by hot air, and the use of air nozzles to control the hot air. So that the heat is concentrated on the BGA to prevent damage to the surrounding components. And through the convection effect of the upper and lower hot air, it can effectively reduce the chance of board deformation. Bottom preheating plate: the role of preheating, remove moisture inside the PCB and BGA, and can effectively reduce the temperature difference between the center point of the heating and the surrounding area, reducing the chances of board deformation.
3. Clamping PCB board fixture and the lower part of the PCB support frame
This part of the PCB board plays a role in fixing and supporting the role of preventing board deformation plays an important role. Optical precision alignment through the screen, as well as automatic welding and automatic desoldering and other functions. Now most of the BGA rework station can be directly through the set temperature for rework, while the hot air gun, although the temperature can be regulated, but can not intuitively observe the real-time temperature, and sometimes overheating is easy to directly burn the BGA.
4. The use of BGA rework station is not easy to damage the BGA chip and PCB board
As we all know, BGA needs to be heated at a high temperature when it is reworked, and the precision of temperature control at this time is very high, and a slight error may lead to the scrapping of the BGA chip and PCB board. The temperature control precision of the BGA rework station can be accurate to within 2 degrees, which can ensure the integrity of the chip in the process of BGA chip rework, but also one of the role of the hot air gun can not be compared. The ultimate core of our rework BGA success is around the rework temperature and board deformation, which is the key technical issues. The machine to a large extent to avoid human influence factors, so that the success rate of rework can be improved and remain stable.
5. BGA rework station can realize the proportionate size of the solder ball
After washing the bga, it can be aligned, and mounted to the pcb, and then flow, so the component rework is complete, it is necessary to point out that the acceptance of manual methods to wash the pad is not timely and thorough removal of impurities. So it is recommended that you choose the fully automatic BGA rework station when you buy BGA rework station, can save you most of the time, personnel costs and money, although in the purchase of fully automatic BGA rework station price is relatively high, but the role of rework efficiency and performance is manual BGA rework station can not be compared to, so you do a good job of evaluation and comparison work before you buy.
Features of NeoDen BGA Rework Station
Power: 5.65KW (Max), Top heater (1.45KW), Bottom heater (1.2KW), IR Preheater (2.7KW), Other (0.3KW)
Operation Method: 7″ HD touch screen
Control System: Autonomous heating control system V2 (software copyright)
Display System: 15″ SD industrial display (720P front screen)
Alignment System: 2 Million Pixel SD digital imaging system, automatic optical zoom with laser: red-dot indicator
Vacuum Adsorption: Automatic
Temperature Control: K-type thermocouple closed-loop control with accuracy up to ±3℃
Feeding Device: No
Positioning: V-groove with universal fixture
Post time: Jul-11-2024