1.Storage condition of solder paste
Solder paste must be applied to SMT patch processing. If the solder paste is not applied immediately, it must be placed in a natural environment of 5-10 degrees, and the temperature must not be less than 0 degrees or higher than 10 degrees.
2.Daily maintenance of SMT machine
SMT pick and place machine to be maintained on time, improve the rules and regulations of equipment spot inspection. If there is embrittlement of machinery and equipment, or the destruction of components, there will be SMT sticking slanting, high throwing and a series of conditions, seriously affecting the production and manufacturing.
3. Upgrading and setting of main processing parameters
To ensure the welding quality of PCB board, we must always pay attention to the reflow oven processing parameters are effective. Generally, the temperature control should be tested twice a day. Only by constantly improving the temperature curve can the quality of products produced and processed be guaranteed.
4.Lifting test method
Due to the complex structure and processing technology of electronic components, the non-destructive testing technology has been put forward very high requirements. The basic inspection methods, including visual inspection, AOI machine, ICT and ultrasonic testing, have long been unable to meet the requirements of relative density, efficient operation and standardization in the FIELD of SMT. X-ray detection method is the best choice to improve the detection quality and production quality at present.Above is the SMT patch processing to pay attention to the key points, do you know these?
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Post time: Dec-23-2020