SMT machine is the core equipment in SMT production line, mainly used for chip components placement. Because of the different speed and placement products, it can be divided into ultra-high-speed pick and place machine, high-speed pick and place machine, medium-speed pick and place machine, etc. The following is the distinction between high-speed chip mounter and medium-speed chip mounter.
1.from the SMT machine structure distinction
Medium-speed machine mostly adopts arch frame structure, relatively simple structure, the placement of the precision is poor, covers an area of small, the requirements of the environment is low high-speed bonder structure more often than the turret structure also more often use composite structure, can meet the precision of micro chip components placement under the realization of high-speed placement.
2.According to SMT mounting machine mounting speed distinction
The theoretical mounting speed of medium speed mounter is generally 30,000 “piece/h (piece type component) about; The theoretical mounting speed of high speed mounter is generally 30,000～60,000 pieces/h per hour (this mainly refers to mount 0603 below piece type component as standard).
3.From the mounter mount product to distinguish.
Medium speed mounter mainly can be used as mount large components, high precision components and shaped components, also can mount small chip components; High speed mounter mainly can be used to mount small chip components and small integrated components.
4.From the mounter’s application range distinction.
Medium-speed bonder is mainly in some small and medium-sized electronic production and processing enterprises, research and development design center and product characteristics for a variety of small batch production enterprises widely used; high-speed bonder is mainly in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises in a large number of use.
The above talk is mainly from the import of large bonder on the distinction. Through the above introduction we can see that the medium speed bonder and high speed bonder can be distinguished mainly through the placement speed, machine structure, placement products and the scope of application. If the production of LED mounter placement speed can reach 15000 / h or more also even if the high-speed mounter.
NeoDen 8 heads Pick and Place Machine
1.8 independent heads with fully closed-loop control system support all 8mm feeder pick up simultaneously,speed up to 13,000 CPH.
2.Equips double mark camera + double side high precision flying camera ensure high speed and accuracy, real speed up to 13,000 CPH. Using the real-time calculation algorithm without virtual parameters for speed counting.
3.Brand functional parts
Japan: THK-C5 grade grinding screw, Panasonic A6 servo motor, Miki high performance coupling.
Korea: Sungil base, WON linear guide, Airtac valve and other industrial brand parts.
All with precision assembly, less wear and aging, stable and durable precision.
4.Support up to 4 pallet tray of chips (optional configuration), larger range and more option.
Post time: Sep-22-2022