I. Classification of SPI machine
Solder paste inspection machine can be divided into 2D measurement and 3D measurement.
1. 2D solder paste inspection machine can only measure the height of a certain point on the solder paste, 3D SPI can measure the solder paste height of the whole pad, more can reflect the real solder paste thickness. In addition to calculating the height, you can also calculate the solder paste area and volume
2. 2D solder paste thickness tester manual focusing, human error is large. 3D thickness gauge computer automatic focus, measured thickness data more accurate.
II. Specification of NeoDen SPI machine
1. Software system:
Operation system: Windows 7 Ultimate 64bit
1) Idetification system:
Feature:3d raster camera(double is optional)
Operate interface:Graphical programming, easy to operate, Chinese and English system switch over
Interface: 2D AND and 3D truecolor image
MARK: Can choose 2 commom mark point
2) Programe: Support gerber, CAD input, offline and manual program
3) SPC
Offline SPC: Support
SPC Report: Anytime Report
Control Graphic: Volume, area, height, offset
Export content: Excel, image (jpg, bmp)
2. Control system
1) Host: Industry control PC, intel 6 core cpu, 16GDDR, 1T
2) Displayer: 22 inch lcd widescreen display
III. Principle of SPI
The detection principle of SPI is basically similar to AOI, which uses optical image to check quality. The solder paste checks the flatness, thickness and offset of the solder paste, so it is necessary to detect a OK board as a sample, and then the PCB board printed in batch will be judged according to the OK board. There may be a lot of defects in the beginning, but this is normal because the machine needs to learn and modify parameters and engineers to maintain it.
Post time: Nov-02-2021