Reflow soldering machine is one of the key processes of SMT processing, and the quality of surface assembly is directly reflected in the reflow soldering results. But reflow soldering in the welding quality problems are not entirely reflow process, because the reflow quality in addition to the temperature profile has a direct relationship with the temperature profile, but also with the SMD processing plant production line equipment conditions, PCB pads of the producibility of the design, component weldability, solder paste quality, the quality of the PCB processing and the SMT processing of the process parameters of each process, and even with the smt SMD processing plant operator’s Operation are closely related.
I. The impact of components
When the component welding end or pin is oxidized or contaminated, reflow soldering will produce poor wetting, soldering, cavities and other welding defects. Component coplanarity is not good, will also lead to welding defects such as soldering.
II. The impact of PCB
SMT placement quality and PCB pad design has a direct relationship.
If the PCB pad design is correct, mounting a small amount of re-skew can be reflow soldering, due to the role of surface tension of the molten solder and be corrected. On the contrary, if the PCB pad design is not correct, even if the mounting position is very accurate, reflow soldering will occur after the component position offset, monumental welding defects, etc. SMT patch quality and PCB pad quality also has a certain relationship, PCB pad oxidation or pollution, PCB pad moisture and other cases, reflow soldering will produce poor wetting, false solder, solder balls, voids and other welding defects.
III. The impact of solder paste
Solder paste in the metal powder content, metal powder oxygen content, viscosity, thixotropy, printability have certain requirements. If the solder paste metal powder content is high, reflux temperature metal powder with the evaporation of solvent and flyover, if the metal powder oxygen content is high, but also exacerbate the spattering, the formation of solder ball, but also cause defects such as non-wetting. In addition, if the salinity of the solder paste is too low or the thixotropy of the solder paste is not good, after printing the solder paste graphic will be Juan trapping, and even caused by the wither, reflow soldering will form a solder ball bridging and other welding defects. If the printability of the solder paste is not good, the printing of the solder paste is just sliding on the template, in this case it is not printed at all solder paste.
Features of NeoDen IN6 Reflow Oven
Full convection, excellent soldering performance.
6 zones design, light and compact.
Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2℃.
Original built-in soldering smoke filtering system, elegant appearance and eco-friendly.
Heat insulation protection design, the casing temperature can be controlled within 40℃.
Household power supply, convenient and practical.
ESD tray, easy to collect PCB after reflowing, convenient for R&D and prototype.
Several working files can be stored, freely switch between Celsius and Fahrenheit, flexible and easy to understand.
Post time: Jun-07-2024