Reflow oven reflow is the process of solder paste in reaching the melting point of the paste, in its liquid surface tension and the role of flux flux back to the component pins to form a solder joint, so that the circuit board pads and components soldered into a whole, also called reflow process. Reflow soldering process flow through the more intuitive understanding.
1. When the PCB circuit board into reflow soldering machine temperature zone, the solvent in the solder paste, gas evaporated, at the same time, the flux in the solder paste wetting pads, component tips and pins, solder paste softened, collapsed, covered the pad, the pad, component pins and oxygen isolation.
2. PCB circuit board into the reflow insulation area, so that the PCB and components to get sufficient preheating, to prevent the PCB suddenly into the soldering high-temperature area and damage to PCB and components.
3. When the PCB enters the reflow zone, the temperature rises rapidly so that the solder paste reaches a molten state, liquid solder on the PCB pads, component tips and pins wetting, diffusion, liquid tin reflow mix to form solder joints.
4. PCB into the reflow cooling area, after reflow soldering cold air effect of liquid tin and reflow to make the solder joints condensed; solidification at this point completed the reflow soldering.
Reflow soldering the entire work process can not be separated from the hot air in the reflow chamber, reflow soldering is to rely on the role of hot airflow on the solder joint, gel-like flux in the fixed high temperature airflow for physical reaction to achieve SMD welding; so called “reflow soldering” because the gas flowing back and forth in the welding machine cycle to generate high temperature to achieve the purpose of welding called reflow soldering.
Features of NeoDen IN6 reflow oven
6 zones design, light and compact.
Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2℃.
Original high-performance aluminum alloy heating plate instead of heating pipe, both energy-saving and high-efficient, and transverse temperature difference is less than 2℃.
PCB soldering temperature curve can be displayed based on real-time measurement.
Approved by TUV CE, authoritative and reliable.
An internal temperature sensor ensures full control of the heating chamber and can reach optimal temperatures in as little as fifteen minutes.
The design implements an aluminum alloy heating plate that increases the energy-efficiency of the system. The internal smoke filtering system improves the product’s performance and reduces harmful output, too.
Post time: Dec-21-2022