SMT AOI Machine Description
AOI system is a simple optical imaging and processing system integrated with cameras, lenses, light sources, computers and other common devices. Under the illumination of the light source, the camera is used for direct imaging, and then the detection is realized by computer processing. The advantages of this simple system are low cost, easy integration, relatively low technical threshold, in the manufacturing process can replace manual inspection, meet the requirements of most occasions.
Where SMT AOI machine can be placed?
(1) After solder paste printing. If the solder paste printing process meets the requirements, the number of defects found by ICT can be significantly reduced. Typical printing defects include the following:
a. Insufficient solder on pad.
b. Too much solder on the pad.
c. Poor coincidence of solder to pad.
d. Solder bridge between pads.
(2) Before reflow oven. The inspection is done after the components are pasted into the paste on the board and before the PCB is fed into the reflux furnace. This is a typical place to place the inspection machine, as this is where most defects from solder paste printing and machine placement can be found. The quantitative process control information generated at this location provides calibration information for high-speed wafer machines and tightly spaced component mounting equipment. This information can be used to modify component placement or indicate that the laminator needs to be calibrated. The inspection of this position satisfies the objective of the process tracking.
(3) After reflow welding. Inspection at the end of the SMT process is the most popular choice for AOI because this is where all assembly errors can be found. Post-reflow inspection provides a high degree of security because it identifies errors caused by solder paste printing, component mounting, and reflow processes.
NeoDen SMT AOI Machine Details
Inspection system Application: fter stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.
Program mode: Manual programming, auto programming, CAD data importing
Inspection Items:
1) Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
2) Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
3) DIP: Missing parts, damage parts, offset, skew, inversion, etc
4) Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG, copper stain etc.
Post time: Nov-11-2021