Application of SMT X-ray inspection machine - Testing Chips

The purpose and method of chip testing

The main purpose of chip testing is to detect factors affecting product quality in the production process as early as possible and to prevent out-of-tolerance batch production, repair and scrap. This is an important method of product process quality control. X-RAY inspection technology with internal fluoroscopy is used for nondestructive inspection and is typically used to detect various defects in chip packages, such as layer peeling, rupture, voids and lead bond integrity. In addition, X-ray nondestructive inspection can also look for defects that may occur during PCB manufacturing, such as poor alignment or bridge openings, shorts or abnormal connections, and detect the integrity of solder balls in the package. It not only detects invisible solder joints, but also analyzes the inspection results qualitatively and quantitatively for early detection of problems.

Chip inspection principle of X-ray technology

X-RAY inspection equipment uses an X-ray tube to generate X-rays through the chip sample, which are projected on the image receiver. Its high-definition imaging can be systematically magnified by 1000 times, thus allowing the internal structure of the chip to be presented more clearly, providing an effective means of inspection to improve the “once-through rate” and to achieve the goal of “zero defects”.

In fact, in the face of the market looks very realistic but the internal structure of those chips have defects, it is clear that they can not be distinguished with the naked eye. Only under X-ray inspection can the “prototype” be revealed. Therefore, X-ray testing equipment provides sufficient assurance and plays an important role in the testing of chips in the production of electronic products.

Advantages of PCB x ray machine

1. The coverage rate of process defects is up to 97%. The defects that can be inspected include: false solder, bridge connection, tablet stand, insufficient solder, air holes, device leakage and so on. In particular, X-RAY can also inspect BGA, CSP and other solder joint hidden devices.

2. Higher test coverage. X-RAY, the inspection equipment in SMT, can inspect places that cannot be inspected by the naked eye and in-line testing. For example, the PCBA is judged to be faulty, suspected to be the PCB inner layer alignment break, X-RAY can be quickly checked.

3. The test preparation time is greatly reduced.

4. Can observe defects that cannot be reliably detected by other testing means, such as: false solder, air holes and poor molding.

5. Inspection equipment X-RAY for double-sided and multilayer boards only once (with delamination function).

6. Provide relevant measurement information used to evaluate the production process in SMT. Such as solder paste thickness, the amount of solder under the solder joint, etc.