SMT X-Ray inspection equipment can detect a variety of internal and external PCB (circuit board) defects, if differentiated according to the region, the following categories of defects can be observed.
I. Welding defects
1. Voiding
Solder joints appear inside the air or other non-metallic substances formed by the void.
2. Too much or too little solder
That is, the solder joint is not enough fullness or over-saturation.
3. Solder bal
Excess solder to form a small ball-shaped objects.
4. Lift-off or Non-Wet
Solder joints and pads are not sufficiently fused.
5. Solder Bridging
Undeserved solder connections between neighboring solder joints.
II. Component assembly defects
1. Missing Component
Not properly installed electronic components.
2. Device pins and pad center offset
Due to poor placement of the device positioning is not allowed to deviate from its proper position.
3. BGA (Ball Grid Array Package) and Flip Chip under the integrity of the solder joints
To confirm the correct connection of the hidden solder joints.
III. PCB defects
1. Cracks and breaks
Physical damage on the PCB substrate.
2. Multilayer board layer defects
For example, interlayer voids or poor stacking may lead to reduced electrical performance.
IV. Conductivity defects
Wrong contact, fixture defects, poor soldering, lack of solder joints and so on.
V. Insulation defects
Short circuit between copper foil layers (Short Circuit), wrong circuit layout, missing or damaged, etc..
VI. structural defects
Line short circuit, line break, open circuit, line alignment problems, etc..
Practical applications of SMT X-ray machine
1. X-Ray inspection can be performed not only on-line during the production process, but also off-line after production.
2. It plays an important role in quality control and can detect and correct defects in time, thus reducing product rework and market return rate.
3. Through X-Ray inspection, it can penetrate the PCB surface to see the internal structure, thus realizing accurate detection of the above defects, which is especially important for high-density and high-precision PCBs.
4. 3D X-RAY has better imaging than 2D X-ray, and it is easier to see the three-dimensional structure inside the object. 3D X-ray is also more costly. According to their own need to observe the actual start of the product, choose the appropriate equipment for observation!
Zhejiang NeoDen Technology Co., LTD., established in 2010 with 100+ employees & 8000+ Sq.m. factory of independent property rights, to ensure the standard management and achieve the most economic effects as well as saving the cost.
Owned the own machining center, skilled assembler, tester and QC engineers, to ensure the strong abilities for NeoDen machines manufacturing, quality and delivery.
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Post time: Feb-27-2025