In SMT inspection, visual inspection and optical equipment inspection are often used. Some methods are visual inspection only, and some are mixed methods. Both of them can inspect 100% of the product, but if the visual inspection method is used, people will always be tired, so it is impossible to ensure that the staff is 100% careful inspection. Therefore, we establish a balanced strategy of inspection and monitoring by establishing quality process control points.
In order to ensure the normal operation of SMT equipment, strengthen the quality inspection of machining workpiece in each process, so as to monitor its running state, and set up quality control points after some key processes.
These control points are usually located in the following locations:
1. PCB inspection
(1) There is no deformation of the printed board;
(2) Whether the welding pad is oxidized;
(3) There are no scratches on the surface of the printed board;
Inspection method: Visual inspection according to the inspection standard.
2. Screen printing detection
(1) Whether the printing is complete;
(2) Whether there is a bridge;
(3) Whether the thickness is uniform;
(4) There is no edge collapse;
(5) There is no deviation in printing;
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard.
3. Patch testing
(1) The mounting position of components;
(2) Whether there is a drop;
(3) There are no wrong parts;
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard.
4. Reflow oven detection
(1) The welding situation of components, whether there are bridge, stele, dislocation, solder ball, virtual welding and other bad welding phenomena.
(2) The situation of the solder joint.
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard.
Post time: May-20-2021