What are the solutions to the high material throwing rate of the chip machine?

Chip machine throwing material is a bad production of the chip machine phenomenon, different brands of chip machine throwing material rate have a reasonable range, beyond a reasonable range, it is necessary to check and solve the problem of high throwing material rate. General placement machine throwing material rate is high are some of the common reasons, the following to explain the solution to the high rate of placement machine throwing material method.

I. Vacuum air pressure problems

First test whether the air pressure is not enough to cause, air pressure will cause air leakage, resulting in the absorption of components or in the process of moving off, resulting in falling parts, poor absorption and other problems caused by the high rate of throwing material, which needs to check whether the cylinder leakage.

II. The nozzle and air tube problems

Suction nozzle in a long time operation use, may lead to deformation, broken, clogging, or long time did not get maintenance maintenance, etc.. Causes such bad, resulting in suction material can not be sucked, which needs to replace the suction nozzle.

III. The lens camera, visual identification system

SMD machine in the operation production, a PCBA board may have more than ten kinds or dozens of electronic components need to be mounted, this function is the visual recognition system on the mounting head to carry on the completion, different material size, specification shape etc. need to be mounted to the designated pad position according to the program in the programming system, the mounting head is to rely on the visual system to carry on the positioning to grab the designated components for mounting, if the camera and the visual recognition system If the camera and the visual recognition system have the dirt and the debris interfere with the recognition, then will cause the recognition error, produces the throw material rate high, this situation then needs to wipe clean the recognition system camera, keeps clean, if is the recognition system damage then needs to replace.

IV. Take material offset

SMD machine mount need to rely on the fly for its material, if the electronic material is not in the center of the suction nozzle position and take the height of the material is not correct, produce offset offset, will be judged as invalid material and discard. If is this kind of reason, then to adjust the height and the position which the flyer supplies the material and the mount head suction nozzle takes the material.

V. Component problems

The supplier’s component itself has a problem or the component and the program entered into the corresponding position, shape, size and specification deviation, the visual recognition system will be judged as a misoperation, resulting in material loss, this problem needs to check whether the component and the corresponding program is the same, and whether the component itself has problems, if there is a problem, promptly contact the A party or the supplier to change the material production.