1. Reduce the temperature of reflow oven or adjust the rate of heating and cooling of the plate during reflow soldering machine to reduce the occurrence of plate bending and warping;
2. The plate with higher TG can withstand higher temperature, increase the ability to withstand pressure deformation caused by high temperature, and relatively speaking, the material cost will increase;
3. Increase the thickness of the board, this is only applicable to the product itself does not require the thickness of the PCB board products, lightweight products can only use other methods;
4. Reduce the number of boards and reduce the size of the circuit board, because the larger the board, the larger the size, the board in the local backflow after high temperature heating, local pressure is different, affected by its own weight, easy to cause local depression deformation in the middle;
5. The tray fixture is used to reduce the deformation of the circuit board. The circuit board is cooled and shrunk after high temperature thermal expansion by reflow welding. The tray fixture can stabilize the circuit board, but the filter tray fixture is more expensive, and it needs to increase the manual placement of the tray fixture.
Post time: Sep-01-2021