PCBA factory use reflow soldering machine, what are the special requirements for components to ensure the quality and reliability of welding?
1. High temperature resistance. This will not affect the packaging of components, reflow soldering machine effectively extend their service life. This is the basic requirements of reflow soldering on the component ware.
Consider the impact of high temperature on the component package. As the traditional surface mount components of the packaging material as long as they can withstand high temperatures of 240 ° C to meet the soldering temperature of the leaded solder, and reflow soldering lead-free soldering for complex products welding temperature up to 260 ° C.
Consider the impact of high temperature on the internal connection of the device. IC internal connection methods have gold wire ball welding, ultrasonic pressure welding, as well as flip-flop soldering and other methods, especially BGA, CSP and the combination of composite components, modules, and other new components, their internal connection with the same materials and surface assembly with the same solder, also with the re-flow soldering process. Therefore, the reflow soldering components within the connection material should also meet the requirements of reflow soldering lead-free soldering.
2. Pad size and layout. Components of the pad design should be in line with IPC standards, to ensure that the pads with the PCB to match, to avoid poor soldering.
3. Lead-free requirements. Out of the environmental requirements of electronic products, the use of lead-free solder (such as SAC alloy) is becoming more and more common, components need to be compatible with lead-free soldering.
4. Thermal cycling. Good thermal cycling can withstand the thermal stress caused by multiple reflow soldering to avoid thermal damage or aging.
5. Pin strength. High pin strength can prevent the solder joints from breaking under the action of external forces.
6. Package type. Some package types may have special requirements for reflow soldering, such as BGA (Ball Grid Array) requires a specific reflow soldering process and equipment to ensure the quality of its welding.
7. Quality Inspection Requirements. Components should be easy to visual inspection and X-ray inspection in order to assess the quality of the solder joints and possible defects.
Features of NeoDen IN12C Reflow oven
1. Built-in welding fume filtration system, effective filtration of harmful gases, beautiful appearance and environmental protection, more in line with the use of high-end environment.
2. Hot air convection, excellent welding performance.
3. The use of high-performance aluminum alloy heating plate instead of heating tube, both energy-saving and efficient, compared with similar reflow ovens on the market, the lateral temperature deviation is significantly reduced.
4. Can store 40 working files.
5. Up to 4-way real-time display of PCB board surface welding temperature curve.
6. lightweight, miniaturization, professional industrial design, flexible application scenarios, more humane.
7. Independent circulating air design of the cooling area, completely isolated from the external environment on the internal temperature cavity.
8. through the special airflow simulation software test optimized welding fume filtration system, can achieve the filtration of harmful gases at the same time to ensure that the equipment shell to maintain room temperature, reduce heat loss and reduce power consumption.
Post time: Dec-24-2024