According to the environmental standards in the solder paste is divided into lead-free solder paste and leaded solder paste, which is lead-free solder paste according to the melting point of the paste is divided into a low-temperature solder paste, medium-temperature solder paste and high-temperature solder paste. In the actual production of how to choose the paste suitable for the patch?
Let’s understand the low temperature solder paste, medium temperature solder paste, high temperature solder paste respective characteristics.
1. Low-temperature solder paste refers to the melting point of 138 ℃ solder paste is called low-temperature solder paste.
When the patch components can not withstand temperatures of 200 ℃ and above, it is necessary to use low temperature solder paste for welding. Low-temperature solder paste plays a role in protecting components and PCB boards, low-temperature solder paste alloy composition is mainly tin-bismuth alloy, reflow oven soldering peak temperature at 170-200 ℃.
2. Medium-temperature solder paste is relative to the low-temperature solder paste and high-temperature solder paste melting point moderate a solder paste, melting point in 172 ℃.
Alloy composition of tin-silver bismuth, mainly used for components that can not withstand high temperatures of welding, LED industry applications, medium temperature solder paste is characterized by the use of imported special rosin, adhesion is good, you can effectively prevent the collapse of the amount of residue after reflow oven soldering is small and transparent, does not interfere with the ICT test, the composition of silver components, the weld firmness is more good.
3. High-temperature solder paste is composed of tin, silver, copper and other alloy components of the melting point of 210-227 ℃ between a lead-free solder paste.
Mainly used in the SMT machine pick and place components or lamp beads can withstand high temperature conditions, high reliability, not easy to desoldering cracked. High-temperature solder paste than low temperature, medium temperature solder paste is more widely used, such as some BGA, QFN, cell phone precision components welding, with high-temperature solder paste effect will be better. It is characterized by good tin climbing effect and long service life. High activity, low void rate, not easy to collapse. The solder joints are full and bright, with high strength and excellent conductivity. Excellent printing performance and demolding performance, micro-fine pin pitch mounting without pressure. Imported flux, can be printed for a long time without affecting the wettability and viscosity of the paste.
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① Established in 2010, 200+ employees, 8000+ Sq.m. factory.
② NeoDen products: Smart series PNP machine, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, Solder paste printer FP2636, PM3040.
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Post time: Apr-10-2024