What are the causes of solder spatter and how to deal with it?
Wave soldering machine soldering is a commonly used electronic manufacturing process. There are many reasons for solder paste spattering due to high temperatures during this process, which may be related to the quality of the solder paste, interconnect structure, operation of the equipment, and environmental factors.
I. What are the causes?
1. Paste quality. First of all, the viscosity of the solder paste needs to be moderate, too high will cause the solder paste to be difficult to flatten, too low will cause the solder paste to be unable to form the correct coating on the surface of the components and PCBs. Secondly, the amount of flux and active agent in the paste needs to be appropriate. If the amount of these substances is too high, the solder paste produces bubbles and fumes at high temperatures, which increases the probability of solder paste splattering. Finally, the service life of the solder paste should not be ignored. Excessively long service life of the solder paste may lead to quality degradation and increase the probability of solder paste spattering.
2. Interconnect structure. When designing interconnect structures, problems incompatible with thermal runaway or component reflow processes should be avoided. Solder pad structure should determine the location of the solder, and in the premise of providing good stability for the component, so that the solder pad itself on the thermal impact of the component as small as possible. If the pad itself has a high thermal impact on the component, it can easily lead to a gap between the pad and the component, resulting in solder paste splatter.
3. Operator and environment. Operator’s operating sequence, equipment adjustment and reliability, atmosphere control and purity and temperature and other factors will affect the quality of PCBA wave soldering. Especially in the high-temperature environment, if not operated properly, will not only lead to solder paste splatter, but also cause harm to the operator. Therefore, operators need to understand the relevant knowledge of PCBA wave soldering and operate in strict accordance with the operating procedures to ensure a safe working environment and stable production quality.
II. How to deal with solder paste splatter?
Solder paste splatter will lead to component damage, or even cause failure, improper use may cause harm to the operator. Therefore, in order to prevent solder paste spattering, we recommend the following measures:
1. Replace the appropriate solder paste to ensure that its quality meets the relevant requirements.
2. Strengthen the design of the interconnect structure to make it reasonable and reduce the gap between the solder pads and components to reduce the probability of solder paste splattering.
3. Carefully control and manage the equipment and atmosphere during the soldering process to maintain the correct operating environment.
4. Train and supervise operators to ensure that they operate in accordance with the protocols and master the relevant knowledge of PCBA wave soldering.
Features of NeoDen ND250 Wave soldering machine
1. The layout of the overall mechanism is reasonably designed, simple to operate and easy to maintain.
2. The first wave and the second wave both adopt stepless electronic frequency conversion technology, independent control, suitable for various types of PCB board welding.
3. The preheating system and welding system both adopt PID control mode, with high precision of temperature control.
4. The area of flux spraying is automatically controlled by the size of PCB without manual adjustment of sensor position.
5. Transportation system adopts stepless electronic speed control system with closed-loop control and stable speed.
6. Wave soldering oven has over-temperature sound light alarm, emergency braking system, all motors have overload protection system.
7. It can be turned on fully automatically according to the date and time set by the user.
Post time: Nov-19-2024