PCBA production process, due to a number of factors will lead to the occurrence of component drop, then many people will immediately think that may be due to the PCBA welding strength is not enough to cause. Component drop and welding strength has a very strong relationship, but many other reasons will also cause the components to fall.
Component soldering strength standards
| Electronic Components | Standards (≥) | |
| CHIP | 0402 | 0.65kgf |
| 0603 | 1.2kgf | |
| 0805 | 1.5kgf | |
| 1206 | 2.0kgf | |
| Diode | 2.0kgf | |
| Audion | 2.5kgf | |
| IC | 4.0kgf | |
When the external thrust exceeds this standard, the component will fall off, which can be solved by replacing the solder paste, but the thrust is not so large can also produce the occurrence of component fall off.
Other factors that cause components to fall off are.
1. the pad shape factor, round pad force than the rectangular pad force to be poor.
2. the component electrode coating is not good.
3. PCB moisture absorption has produced a delamination, no baking.
4. PCB pad problems, and PCB pad design, production-related.
Summary
PCBA welding strength is not the main reason for the components to fall off, the reasons are more.
Post time: Mar-01-2022