How to determine the quality of BGA welding, with what equipment or what testing methods? The following to tell you about the BGA welding quality inspection methods in this regard.
BGA welding unlike the capacitor-resistor or external pin class IC, you can see the quality of welding on the outside. bga solder joints in the wafer below, through the dense tin ball and PCB board location. After SMT reflow oven or wave soldering machine is completed, it looks like a black square on the board, opaque, so it is very difficult to judge with the naked eye whether the internal soldering quality meets the specifications.
Then we can only use professional X-RAY to irradiate, through the X-RAY light machine through the BGA surface and PCB board, after the image and algorithm synthesis, to determine whether the BGA welding empty solder, false solder, broken tin ball and other quality problems.
Principle of X-RAY
By X-RAY sweeping the internal line fault of the surface to stratify the solder balls and produce the fault photo effect, then the BGA’s solder balls are stratified to produce the fault photo effect. X-RAY photo can be compared according to the original CAD design data and user-set parameters, so that it can conclude whether the solder is qualified or not in due time.
Specifications of NeoDen X ray machine
X-Ray Tube Source Specification
Type Sealed Micro-Focus X-Ray Tube
voltage Range: 40-90KV
current Range: 10-200 μA
Max Output Power: 8 W
Micro Focus Spot Size: 15μm
Flat Panel Detector Specification
Type TFT Industrial Dynamic FPD
Pixel Matrix: 768×768
Field of View: 65mm×65mm
Resolution: 5.8Lp/mm
Frame: (1×1) 40fps
A/D Conversion Bit: 16bits
Dimensions L850mm×W1000mm×H1700mm
Input Power: 220V,10A/110V, 15A, 50-60HZ
Max Sample Size: 280mm×320mm
Control System Industrial PC: WIN7/ WIN10 64bits
Net Weight About: 750KG
Post time: Aug-05-2022