VGA OUT PCB Design Considerations

VGA (Video Graphics Array) that is, video graphics array, with high resolution, fast display rate, rich colours, etc. VGA interface is not only the standard interface for CRT display devices, but also the standard interface for LcD liquid crystal display devices, with a wide range of applications.

VGA OUT PCB design considerations

1. The overall layout, VGA seat as close as possible to the conversion chip placed, try to shorten the VGA analog signal alignment.

2. The decoupling capacitors of the conversion chip power supply need to be placed as close as possible to the power supply pins of the conversion chip.

3. VGA_R/G/B need to connect a 75ohm pull-down resistor, precision of 1%; resistor must be placed close to the chip.

4. VGA_R / G / B alignment line width as thick as possible, it is recommended that more than 12mil, and the length difference between them shall not exceed 200mil.

5. VGA_R / G / B signal requirements throughout the separate packet ground processing, packet ground alignment interval of 300mil or less must have a ground over the hole.

6. VGA_R / G / B signal adjacent to the layer must be the ground plane, not the power plane.

7. VGA_R/G/B signals are away from LCD, DRAM and other high-speed signal lines, prohibited in the high-speed signal lines adjacent to the layer alignment; prohibited in the high-speed signal lines near the hole for layer; alignment do not pass through the inductive region; away from RF signals and devices;

8. VGA_HSYNC/VSYNC RC filter must be placed close to the VGA seat, the alignment must not exceed 6 Inch.

9. VGA seat all signals TVS tube should be placed as close as possible to the connection seat, the signal topology: VGA seat → TVS → chip pin; ESD phenomenon, ESD current must first pass through the TVS device attenuation; TVS device alignment do not have a residual stump (Stub); TVS ground pins are recommended to try to increase the ground over the hole, at least to ensure that the two 0.4 * 0.2mm over the hole, to strengthen the electrostatic discharge capability. Strengthen the electrostatic discharge capacity.

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