SMD processing first need to scrape a layer of solder paste on top of the pcb pad, solder paste printing needs to be done after the quality of the test, test the name of the machine is called spi (solder paste testing machine), the main test of the solder paste printing whether there is offset, pull the tip, the thickness and flatness, etc., because the quality of the solder paste printing directly affects the quality of the quality of the weld behind, the industry weld the reason for poor more than 60% of the problems is the printing of the solder paste! Caused by more than 60% of the causes of poor soldering in the industry is the solder paste printing problems, enough to prove how important the solder paste printing test.
The meaning of SPI through rate
Solder Paste Printing Inspection (SPI) and AOI testing have a straight through rate, straight through rate from the word can be well understood, directly through the probability, can also become a success rate, the higher the straight through rate, the higher the productivity and production capacity, if the straight through rate is low, it means that the process does not work, affecting the capacity of the efficiency.
The significance of straight through rate control
Straight through rate also indicates the success rate, the higher the straight through rate, the higher the level of production technology, the probability of direct passage, and not always report bad or wrong, straight through rate is high, high productivity, high capacity, straight through rate is low, the lack of production technology, and will affect the production efficiency and time costs, but also indirectly lead to the cost of more manpower, material costs for maintenance. Therefore, the straight-through rate control for a processing plant not only represents the level of production quality, but also relates to the production efficiency of the factory.
Factors affecting spi through rate
Solder Paste
If the liquidity of solder paste is too big, it is easy to cause the solder paste to shift and collapse on the pad, resulting in poor printing, we need to use the solder paste to fully return to the temperature and stirring.
Squeegee
Squeegee pressure, speed, angle will affect the amount of solder paste printed on the pcb pad (thickness and flatness), if the thickness is too much or too little, it will cause short circuit or empty soldering.
Stencil hole size and the smoothness of the hole wall will affect the solder paste seepage, and if the stencil hole wall has hairs, it will also be easy to cause solder paste residue.
Features of NeoDen SPI Machine
Software system:
Operation system: Windows 7 Ultimate 64bit
1) Idetification system:
Feature:3d raster camera(double is optional)
Operate interface: Graphical programming, easy to operate, Chinese and English system switch over
Interface: 2D AND and 3D truecolor image
MARK: Can choose 2 commom mark point
2) Programe:Support gerber,CAD input,offline and manual program
3) SPC
Offline SPC: Support
SPC Report: Anytime Report
Control Graphic: Volume, area, height, offset
Export content: Excel, image(jpg,bmp)
Post time: Aug-01-2023