I. Wave soldering machine temperature control
Refers to the nozzle outlet temperature of the solder wave. General temperature control at 230 – 250 ℃, the temperature is too low will make the solder joint rough, pull, not bright. Even cause false solder, false solder; temperature is too high easy to accelerate the oxidation, printed circuit board deformation, and even hot components. Temperature adjustment should be based on the material and size of the printed circuit board, the ambient temperature, the conveyor belt speed to adjust accordingly.
II. on time to remove wave solder slag
Tin slot in the tin material for a long time in contact with the air is easy to form oxide, the accumulation of more oxide will be in the role of the pump with the tin spray to the printed board, so that the solder joint gloss, resulting in defects such as slag holes and bridges, so to regularly remove the oxide ( general 1 hour cleaning times). Can also be added to the molten solder anti-oxidant. This can not only prevent oxidation and can restore the oxide to tin.
III. Wave soldering wave height debugging
The height of the wave is well adjusted to the thickness of the printed board 1/2-1/3 appropriate, wave too low will cause leakage and hanging tin, wave too high will cause too much tin pile. Even scalding components.
IV. Wave soldering transmission speed
Transmission speed is generally controlled at 0.3 ~ 1.2m / s, according to the specific decision. Winter hands, printed circuit board lines wide, components, components with large heat capacity, the speed can be a little slower; anti-speed can be faster. Speed is too fast welding time is too short, easy to cause false welding, false welding, leakage, bridge, bubbles and other phenomena; speed is too slow. Then the welding time is too long, the temperature is too high, easy to damage the printed circuit board and components.
V. Wave soldering transmission angle
The transmission angle – generally selected between 5 to 8 degrees, according to the area of the printed circuit board and the number of components inserted to decide.
VI. The analysis of the composition
The solder in the solder bath after the use of – a period of time called between. Will make the tin-lead solder impurities increase, mainly copper ion impurities affect the quality of welding. Generally to 3 months of laboratory analysis times. If the impurities exceed the permitted content, measures should be taken, or even exchanged.
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.
With global presence in over 130 countries, the excellent performance, high accuracy and reliability of NeoDen PNP machines make them perfect for R&D, professional prototyping and small to medium batch production. We provide professional solution of one stop SMT equipment.
Add: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Zhejiang Province, China
Phone: 86-571-26266266
Post time: Mar-29-2022