First of all, let’s understand what is a solder joint pull-tip? Tip pulling usually refers to the phenomenon of solder forming a sharp peak or corner at the top of the solder joint during the soldering process. The main causes are defective solder wetting or excessive soldering time. Below we will discuss these causes in detail and provide appropriate solutions.
1. Related to the wettability of the solder
Poor solder wettability can lead to the formation of solder joints with pull tips. There are many reasons for poor solder wettability, such as insufficient flux content in the composition of the solder, flux activity decreases. In order to solve this problem, first of all, we should ensure that the quality of the solder meets the requirements, the solder composition of the flux content should meet the standard requirements, so as to improve the wettability of the solder. In addition, the regular replacement of the use of solder, to prevent the decline in flux activity is also an effective way to prevent the problem of solder joints pull the tip of the problem.
2. Soldering time is too long
Soldering time is too long will lead to the high temperature of the solder joints, which in turn causes the solidification of the solder to extend the time, resulting in the formation of solder joints pull tip. Therefore, in the PCBA welding process, the welding time should be accurately controlled to avoid excessive welding time. Can be adjusted by adjusting the parameters of reflow oven or wave soldering machine, such as controlling the welding temperature, welding speed, etc., to achieve the purpose of reducing the welding time, so as to avoid the occurrence of the problem of solder joints pull-tip.
3. May be related to the welding process of the plate surface condition
If there is dirt, oxides or other impurities on the surface of the welded plate, the solder will be hindered in the welding process, forming a pull-tip. Therefore, before carrying out the welding, it should be ensured that the surface of the welding plate is clean and free of dirt, and the necessary cleaning treatment should be carried out. At the same time, you can also take the use of flux methods to help the solder better wetting of the welding plate, thereby reducing the occurrence of the problem of welding point pull tip.
4. Affected by the design and material of the welding head
If the design of the soldering head is not reasonable, the distribution of solder will be uneven, resulting in the formation of sharp solder joints. In addition, the choice of soldering head material will also have a certain impact on the solder joint pull-tip. Therefore, before welding, you should choose the appropriate design of the soldering head, and ensure that the quality of the soldering head material meets the requirements, in order to minimize the occurrence of solder joint pull-tip problems.
When the weld joint pull-tip problem occurs, there are some methods that can be taken to solve this problem. For example, you can use the appropriate adjustment of welding parameters, such as reducing the welding temperature, shorten the welding time, etc., to improve the situation of welding point pull tip. In addition, you can also change the settings of the welding equipment, such as replacing the appropriate welding head, improve the activity of the flux, etc., to solve the problem of solder joint pulling tip. It should be noted that the method of solving the solder joint pull-tip problem should be selected according to the specific situation, and make appropriate adjustments and improvements in actual operation.
Summarize
PCBA welding in the solder joints pull-tip is caused by a number of factors together. Poor solder wetting, welding time is too long, the surface of the plate, the solder head design and material selection may lead to the formation of solder joints pull-tip. In response to these problems, we can take appropriate solutions, such as ensuring the quality of solder, controlling the soldering time, cleaning the surface of the plate, and selecting the appropriate tip design and material to minimize the occurrence of solder joint pull-tip problems. Through the above detailed discussion and solutions, I believe we have a better understanding of the PCBA solder joint pull-tip problem.
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Post time: Mar-13-2024