BGA rework station is a professional equipment used to repair BGA components, which is often used in the SMT industry. Next, we will introduce the basic principle of BGA rework station and analyze the key factors to improve the repair rate of BGA.
BGA rework station can be divided into optical counterpoint repair table and non-optical counterpoint repair table. Optical counterpoint refers to the alignment of optics during welding, which can ensure the accuracy of welding alignment and improve the success rate of welding. Non-optical counterpoint, which is done visually, is less accurate when welding.
At present, the main heating methods of BGA rework station include full infrared, full hot air and two hot air and one infrared. Different heating methods have different advantages and disadvantages. The standard heating method of BGA rework station in China is generally hot air at the upper and lower parts and infrared preheating at the bottom, referred to as three-temperature zone. The upper and lower heating heads are heated by heating wire and the hot air is exported by air flow. Bottom preheating can be divided into dark red outer heating tube, infrared heating plate and infrared light wave heating plate.
1. Heating up and down the limelight
Through the heating wire heating, the hot air will be transmitted to the BGA components through the air nozzle, to achieve the purpose of heating BGA components, and through the upper and lower hot air blowing, can prevent the circuit board uneven heating deformation.
2. Bottom infrared heating
Infrared heating mainly plays a preheating role, removing the moisture in the circuit board and BGA, and can also effectively reduce the temperature difference between the heating center and the surrounding, reducing the probability of circuit board deformation.
3. Support and fixture of BGA rework station
This part mainly supports and fixes the circuit board and plays an important role in preventing the deformation of the board.
4. Temperature control
When dismantling and welding BGA, there is an important requirement for temperature. If the temperature is too high, it is easy to burn BGA components. Therefore, the repair table is generally controlled without instrument, but adopts PLC control and full computer control, which can control the temperature in real time.
When repairing BGA by rework station, it is mainly to control the heating temperature and prevent the deformation of the circuit board. Only by doing these two parts well can the success rate of repairing BGA be really improved.
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Post time: Oct-15-2021