1. PCB boards are fed into the solder paste printer along the conveyor belt.
2. The machine finds the main edge of the PCB and positions it.
3. The Z-frame moves up to the position of the vacuum board.
4. Add vacuum and fix the PCB firmly in the specific position.
5. Visual axis (lens) slowly moves to the first target (reference point) of PCB.
6. Vision axis (lens) to find the corresponding stencil below the target (reference point).
7. the machine moves the stencil so that it is aligned with the PCB, the machine can make the stencil move in the X, Y-axis direction and rotate in the θ-axis direction.
8. The stencil and PCB are aligned and the Z-frame will move up to drive the PCB to touch the underside of the printed stencil.
9. Once moved into place, the squeegee will push the solder paste to roll on the stencil and print on the PAD bit of the PCB through the hole on the stencil.
10. When printing is complete, the Z-frame moves downward driving the PCB to separate from the stencil.
11. The machine will send out the PCB to the next process.
12. The printer asks to receive the next pcb product to be printed.
13. Carry out the same process, only with a second squeegee to print in the opposite direction.
Features of NeoDen solder paste printing machine
Printing parameters
Printing head: Floating intelligent printing head (two independent direct connected motors)
Template frame size: 470mm*370mm~737 mm*737 mm
Maximum printing area (X*Y): 450mm*350mm
Squeegee type: Steel/Glue Squeegee (Angel 45°/50°/60° matching the printing process)
Squeegee length: 300mm (optional with length of 200mm-500mm)
Squeegee height: 65±1mm
Squeegee thickness:0.25mm Diamond-like carbon coating
Printing mode: Single or double Squeegee printing
Demoulding length: 0.02mm-12mm Printing speed:0~200mm/s
Printing pressure: 0.5kg-10Kg Printing stroke:±200mm (From the center)
Cleaning parameters
Cleaning mode: 1. Drip cleaning system;
2. Dry, wet and vacuum modes Length of cleaning and wiping plate
Post time: Jun-23-2022