SMT X-ray equipment plays a vital role in the detection of defects and flaws in integrated circuits. The following is a detailed description of the X-ray inspection equipment in the integrated circuit defects and flaws detection.
I. The detection principle of X-ray detection equipment based on the X-ray penetration of the measured material when there are different degrees of attenuation of the law. When X-rays through the integrated circuits and other substances under test, due to the density of the material under test, the thickness of the differences in the X-ray intensity will change accordingly. The high density and thickness of the material absorbs more X-rays, while the low density and thickness of the material absorbs less X-rays. When X-rays pass through the material under test and reach the detector, the attenuated X-rays are converted into visible light and imaged on a photo or sensor/>optical sensor. Due to differences in the intensity of the transmitted X-rays, there are differences in the intensity of the converted visible light, resulting in images of different densities on the negative or sensor. These images can reflect the defects and flaws within the integrated circuit.
II. The scope of detection X-ray inspection equipment can detect a variety of defects and flaws in integrated circuits, including but not limited to:
Poor soldering: such as missing solder joints, wrong polarity, unrecognizable solder joints, false solder (solder fails to completely cover the solder joints, resulting in poor contact), solder bridging, solder bead holes, mismatches, open holes, leakage of the ball of the solder, and the solder joints are fractured. Among them, false soldering may appear on the image as blurred, whitish or inconsistent size of solder joints.
Damage and injury: Damage or injury to the chip due to excessive pressure, high temperature or other factors.
Electrical Problems: Poor electrical conductivity in wires or circuit boards, such as short circuits (where solder bridges between adjoining different solder joints, wires or components) and open circuits.
Missing parts: Parts or components that are partially missing.
Foreign matter: Problems caused by impurities or other substances.
Dimensional problems: Dimensional deviations or errors.
Metal penetration problem: Problems caused by metal penetration.
Void problem: Problems caused by cavities.
Packaging process defects: such as layer peeling, cracking, cavities and wire bonding process problems.
Manufacturing process defects: such as welding line offset.
III. The detection advantages of non-destructive: X-ray inspection equipment can be detected without destroying the integrated circuit, to avoid product scrap due to testing.
High precision: X-ray inspection equipment with high precision, can detect small defects and flaws, to ensure product quality.
High efficiency: X-ray inspection equipment can quickly complete the inspection task and improve production efficiency.
Strong adaptability: X-ray inspection equipment is suitable for different types and sizes of integrated circuits inspection, with a wide range of applicability.
Description of NeoDen ND56X SMT X-ray machine
1. Miniaturized equipment, easy to install and operate.
2. Applicable to Chip, LED, BGA/CSR Wafer, SOP/QFN, SMT and PTU packaging, Sensors, Connectors, and Precision Castings inspection.
3. High resolution design to get the best image in a very short time.
4. Infrared automatic navigation and positioning function can select the shooting location quickly.
5. CNC inspection mode which can quickly and automatically inspect multi-point array.
6. Inclined multi-angle inspection makes it easier to inspect sample defects.
7. Simple softwareoperation, low operating costs.
8. Long lifespan.
Post time: Dec-05-2024