SMT quality analysis

The common quality problems of SMT work including missing parts, side pieces, turnover parts, deviation, damaged parts, etc.

1. The main causes of patch leakage are as follows:

① The feeding of component feeder is not in place.

② The air path of the component suction nozzle is blocked, the suction nozzle is damaged, and the height of the suction nozzle is incorrect.

③ The vacuum gas path of the equipment is faulty and blocked.

④ The circuit board is out of stock and deformed.

⑤ There is no solder paste or too little solder paste on the pad of the circuit board.

⑥ Component quality problem, thickness of the same product is not consistent.

⑦ There are errors and omissions in calling program of SMT machine, or wrong selection of component thickness parameters during programming.

⑧ Human factors were accidentally touched off.

2. The main factors that cause SMC resistor to turn over and side parts are as follows

① Abnormal feeding of component feeder.

② The height of the suction nozzle of the mounting head is not correct.

③ The height of the mounting head is not correct.

④ The size of the feeding hole of the component braid is too large, and the component turns over due to vibration.

⑤ The direction of the bulk material put into the braid is reversed.

3. The main factors leading to the deviation of the chip are as follows

① The X-Y axis coordinates of components are not correct when the placement machine is programmed.

② The reason of tip suction nozzle is that the material is not stable.

4. The main factors leading to damage of components during chip placement are as follows:

① The positioning thimble is too high, so that the position of the circuit board is too high, and the components are squeezed during mounting.

② The z-axis coordinates of components are not correct when the placement machine is programmed.

③ The suction nozzle spring of the mounting head is stuck.


Post time: Sep-07-2020

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