The common quality problems of SMT work including missing parts, side pieces, turnover parts, deviation, damaged parts, etc.
1. The main causes of patch leakage are as follows:
① The feeding of component feeder is not in place.
② The air path of the component suction nozzle is blocked, the suction nozzle is damaged, and the height of the suction nozzle is incorrect.
③ The vacuum gas path of the equipment is faulty and blocked.
④ The circuit board is out of stock and deformed.
⑤ There is no solder paste or too little solder paste on the pad of the circuit board.
⑥ Component quality problem, thickness of the same product is not consistent.
⑦ There are errors and omissions in calling program of SMT machine, or wrong selection of component thickness parameters during programming.
⑧ Human factors were accidentally touched off.
2. The main factors that cause SMC resistor to turn over and side parts are as follows
① Abnormal feeding of component feeder.
② The height of the suction nozzle of the mounting head is not correct.
③ The height of the mounting head is not correct.
④ The size of the feeding hole of the component braid is too large, and the component turns over due to vibration.
⑤ The direction of the bulk material put into the braid is reversed.
3. The main factors leading to the deviation of the chip are as follows
① The X-Y axis coordinates of components are not correct when the placement machine is programmed.
② The reason of tip suction nozzle is that the material is not stable.
4. The main factors leading to damage of components during chip placement are as follows:
① The positioning thimble is too high, so that the position of the circuit board is too high, and the components are squeezed during mounting.
② The z-axis coordinates of components are not correct when the placement machine is programmed.
③ The suction nozzle spring of the mounting head is stuck.
Post time: Sep-07-2020