I. Design rules

1. Design optimization

Before starting PCBA processing, detailed circuit design and layout optimization must be carried out. Designers should take into account the layout of components, wiring density, pad size, over-hole design and other factors to ensure signal integrity and electromagnetic compatibility.

2. Design for Manufacturability (DFM)

The design must comply with the principle of manufacturability to simplify the SMT production line process and reduce manufacturing costs. Complex alignments and narrow pads should be avoided, while considering component accessibility and maintainability.

II. The rules of material selection

1. PCB board selection

According to the application area and working environment of the product, select the appropriate PCB substrate (such as FR4, ceramic, metal substrate, etc.). Also consider the thickness of the plate, the number of layers and surface treatment (such as HASL, ENIG, etc.), in order to meet the requirements of electrical performance and environmental resistance.

2. Component selection

The selection of components should be in line with the design specifications and reliability requirements, and to ensure that its size, pin shape and the pad on the PCB board to match.

III. The production process rules

1. Solder paste printer printing

Solder paste printing must strictly control the thickness and distribution of solder paste to ensure that the solder paste evenly covers the pad. The use of professional stencil and solder paste printing machine, regular inspection and cleaning of the stencil to avoid solder paste contamination.

2. Component placement

Component placement should use high-precision chip mounter to ensure that the components are accurately placed in the designated position. For different types of components, the pressure, speed and nozzle of the placement machine should be adjusted to avoid component damage or offset.

3. Reflow soldering

Reflow oven soldering temperature profile must be precisely controlled to ensure that all solder joints are fully melted and form a reliable solder connection. The quality of the soldered joints should be checked after soldering to ensure that there are no defects such as false soldering, continuous soldering and cold soldering.

4. Wave soldering

For DIP components, wave soldering is a common process. It is necessary to ensure the stability of the welding temperature and speed to avoid insufficient or excessive solder. For the boards after welding, visual inspection or automatic optical inspection should be carried out to ensure the quality of solder joints.

IV. Detection and quality control rules

1. Optical Inspection (AOI)

AOI inspection machine can effectively improve the detection efficiency and accuracy, and is an important means to ensure product quality.

2. X-ray inspection

For high-density BGA, CSP and other packaging components, X-ray inspection can check the quality of the connection inside the solder joints, and find potential open circuits, short circuits, voids and other defects. Especially when inspecting double-sided PCBs, X-ray inspection can provide a more intuitive analysis of the internal structure.

3. Functional testing

After completing all the physical connections, functional testing is required to verify that the functions of the PCBA board work properly according to the design requirements. This includes power test, signal test, communication test, etc.. Functional testing can identify and eliminate potential functional problems in a timely manner.

V. Environmental control and protection rules

1. Electrostatic protection (ESD)

the production area must do electrostatic protection, strictly enforced, and carefully regulate the air humidity, so that it becomes a static electricity “natural barrier.

2. Cleaning and Packaging

Remove the flux residue on the PCBA board “stains” to avoid affecting the electrical performance. Packaging, the use of moisture-proof, anti-static packaging materials. Careful inspection before packaging to ensure that they are not damaged in transportation and storage.

VI. Quality control rules

1. Whole process quality control

PCBA board processing, each step needs to be embedded in a strict quality control network. Ensure product reliability and consistency.

2. Continuous Improvement

The production process needs to be regularly evaluated and optimized to accept new technologies and techniques. This not only enhances production efficiency, cut costs, but also allows the product quality to continue to rise.

About NeoDen

1. Established in 2010, 200+ employees, 8000+ Sq.m. factory.

2. NeoDen products: Smart series PNP machine, NeoDen N10P, NeoDen9, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, IN12C, Solder paste printer FP2636, PM3040.

3. Successful 10000+ customers across the globe.

4. 30+ Global Agents covered in Asia, Europe, America, Oceania and Africa.

5. R&D Center: 3 R&D departments with 25+ professional R&D engineers.

6. Listed with CE and got 50+ patents.

7. 30+ quality control and technical support engineers, 15+ senior international sales, timely customer responding within 8 hours, professional solutions providing within 24 hours.