At present, PCB copying is also commonly referred to as PCB cloning, PCB reverse design, or PCB reverse R&D in the industry. There are many opinions about the definition of PCB copying in the industry and academia, but they are not complete. If we want to give an accurate definition of PCB copying, we can learn from the authoritative PCB copying laboratory in China: PCB copying Board, that is, on the premise of existing electronic products and circuit boards, reverse analysis of circuit boards is carried out by means of reverse R & D technology, and the PCB documents, BOM documents, schematic diagram documents and PCB silkscreen production documents of the original products are restored in 1:1 ratio, and then PCB boards and components are made by using these technical documents and production documents Parts welding, flying pin test, circuit board debugging, a complete copy of the original circuit board template. Because the electronic products are all made up of all kinds of circuit boards, the whole set of technical data of any electronic products can be extracted and the products can be copied and cloned by using the process of PCB copying.
The technical implementation process of PCB board reading is simple, that is, the first scan the circuit board to be copied, record the detailed component location, then dismantle the components to make BOM and arrange material purchase, then scan the blank board to take pictures, and then process them by board reading software to restore them to PCB board drawing files, and then send the PCB files to the plate making factory to make boards. After the boards are made, they will be purchased Components are welded to the PCB, and then tested and debugged.
The specific technical steps are as follows:
Step 1: get a PCB, first record the models, parameters, and positions of all the components on the paper, especially the direction of the diode, three-stage tube, and IC notch. It’s better to take two pictures of the location of the gas element with a digital camera. Now the PCB circuit board is more and more advanced, and the diode triode on it is not visible.
Step 2: Remove all components and tin from the pad hole. Clean the PCB with alcohol and put it into the scanner. When the scanner is scanning, it needs to slightly raise some scanning pixels to get a clearer image. Then polish the top layer and bottom layer slightly with water gauze paper until the copper film is bright, put them into the scanner, start Photoshop, and sweep the two layers in color. Note that the PCB must be placed horizontally and vertically in the scanner, otherwise the scanned image cannot be used.
Step 3: Adjust the contrast and brightness of the canvas to make the contrast between the part with copper film and the part without copper film strong. Then turn the secondary image to black and white to check whether the lines are clear. If not, repeat this step. If it is clear, save the drawing as top BMP and BOT BMP files in black and white BMP format. If there is any problem with the drawing, you can use Photoshop to repair and correct it.
The fourth step: convert two BMP format files into PROTEL format files, and transfer them into two layers in PROTEL. If the location of PAD and VIA over two levels basically coincides, it shows that the first few steps are very good, and if there are deviations, repeat the third steps. So PCB board copying is very patient work, because a little problem will affect the quality and matching degree after board copying. Step 5: convert the BMP of the top layer to the top PCB. Pay attention to convert it to the silk layer, which is the yellow layer.
Then you can trace the line in the top layer, and place the device according to the drawing in step 2. Delete the silk layer after drawing. Repeat until all layers are drawn.
Step 6: transfer in the top PCB and BOT PCB in Protel and combine them into one figure.
Step 7: use laser printer to print top layer and bottom layer on transparent film (1:1 ratio), but the film on that PCB, and compare whether there is an error. If you are right, you will succeed.
A copy board like the original board was born, but it was only half-finished. We also need to test whether the electronic technical performance of the board is the same as that of the original board. If it’s the same, it’s really done.
Note: if it is a multilayer board, it should be carefully polished to the inner layer, and repeat the copying steps from step 3 to step 5. Of course, the naming of the figure is also different. It should be determined according to the number of layers. Generally, the copying of the double-sided board is much simpler than that of the multilayer board, and the alignment of the multilayer board is prone to be inaccurate, so the copying of the multilayer board should be particularly careful and careful (in which the internal through-hole and the It’s easy to have problems with the through-holes).
Double-sided board copying method:
1. Scan the upper and lower surface of the circuit board, and save two BMP pictures.
2. Open the copy board software, click “file” and “open base map” to open a scanned image. Enlarge the screen with page, see the pad, press PP to place a pad, see the line, and press PT to route Just like a child’s drawing, draw once in this software, and click “save” to generate a B2P file.
3. Click “file” and “open bottom” again to open the scanned color map of another layer; 4. Click “file” and “open” again to open the B2P file saved previously. We see the newly copied board, which is stacked on this picture – the same PCB board, the holes are in the same position, but the circuit connection is different. So we press “options” — “Layer Settings”, here turn off the circuit and screen printing of the display top layer, leaving only multi-layer vias. 5. The vias on the top layer are the same as those on the bottom layer.
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Post time: Jul-20-2020