News
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Why is the choice of BGA chip X-ray inspection equipment critical to product quality?
The choice of BGA chip SMT X-ray inspection equipment is critical to improving product quality. 1. Improve product performance BGA chip X-ray inspection equipment can detect every solder joint in the BGA chip, so as to find out the defects of the solder joints, thus improving the performance, rel...Read more -
Classification and Selection of Wave Soldering Fluxes
Wave soldering machines are a common type of PCB soldering equipment that makes soldered connections by placing electronic components and circuit boards (with flux pre-coated on the soldered areas of the boards) on waves of molten solder. Wave soldering usually requires the use of flux to improve...Read more -
Miniaturization trends and technical challenges in PCBA processing
Miniaturization in PCBA processing not only improves the portability and functional integration of devices, but also brings new technical challenges. In this paper, we will discuss the trend of miniaturization in PCBA processing and the technical challenges it faces, and provide coping strategies...Read more -
What are the common faults of solder paste printing?
I. Diagnosis and treatment of tin lap 1. Description of the phenomenon: a small amount of solder paste between the two solder pads overlap. In high-temperature welding is often pulled back by the main tin body on each pad, once you can not pull back, will cause a short circuit of the tin ball or ...Read more -
What are the environmentally friendly technologies in PCBA processing?
In PCBA processing, the use of environmentally friendly technology can not only reduce the negative impact on the environment, but also enhance the social responsibility of enterprises. I. Lead-free soldering technology Lead-free soldering materials mainly include tin-silver-copper alloy (SAC), t...Read more -
How to ensure data security in PCBA processing?
In the PCBA processing industry, securing data is equally crucial. In this article, we will discuss how to ensure data security in PCBA processing to provide some reference and guidance. 1. The establishment of a sound data security policy First of all, PCBA processing companies need to establish...Read more -
How to measure the reflow oven profile?
I. What are the methods to measure the reflow oven profile? 1. Use the long thermocouple wire that comes with the reflow oven itself. One end of the thermocouple wire is soldered to the PCB board and the other end is plugged into a preset thermocouple socket on the unit. Place the board in the fu...Read more -
Green Manufacturing Technology in PCBA Processing
With the enhancement of environmental awareness and strict industry regulations, green manufacturing technology can not only reduce the impact on the environment, but also improve production efficiency and market competitiveness of enterprises. 1. The application of green materials Selection of e...Read more -
How to achieve PCBA processing standardization?
PCBA processing process standardization has a key impact on product quality, production efficiency and cost control. Through the realization of process standardization, enterprises can improve production consistency, reduce the failure rate, and enhance market competitiveness. I. The establishmen...Read more -
Elektrotec 2024
Aug. 16-18 | one of the largest Electrical and Industrial Electronics sector trade event in India NeoDen India – CHIPMAX DESIGNS PVT LTD will take the popular at Elektrotec 2024 exhibition, welcome to visit us at Hall B-116-117. OPENING HOURS 9 – 12 AUGUST: 10:00-15:00 F...Read more -
How Is Solder Joint Quality Controlled?
Solder joint defects such as weak soldering, cold soldering and solder bridges can lead to unstable board functionality or complete failure. Effective solder joint quality control not only improves product quality, but also reduces rework and scrap rates. I. Soldering process optimization 1. Weld...Read more -
Failure Analysis and Troubleshooting in PCBA Processing
In PCBA processing, systematic identification and resolution of faults can improve product reliability and reduce production costs. I. Common types of failure 1. Welding defects Soldering defects are the most common problems in PCBA processing, including false soldering, cold soldering, solder br...Read more
