News
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Function analysis of various SMT appearance inspection equipment AOI
a) : Used to measure the solder paste printing quality inspection machine SPI after the printing machine: SPI inspection is carried out after the solder paste printing, and defects in the printing process can be found, thereby reducing the soldering defects caused by poor solder paste printing to...Read more -
SMT testing equipment application and development trend
With the development trend of the miniaturization of SMD components and the higher and higher requirements of the SMT process, the electronic manufacturing industry has higher and higher requirements for testing equipment. In the future, SMT production workshops should have more testing equipment...Read more -
How to setting of furnace temperature curve?
At present, many advanced electronic product manufacturers at home and abroad have proposed a new equipment maintenance concept “synchronous maintenance” in order to further reduce the impact of maintenance on production efficiency. That is, when the reflow oven is working at full cap...Read more -
Requirements for lead-free reflow oven equipment materials and construction
l Lead-free high temperature requirements for equipment materials Lead-free production requires equipment to withstand higher temperatures than leaded production. If there is a problem with the equipment material, a series of problems such as furnace cavity warpage, track deformation, and poor se...Read more -
The two points of controlling wind speed for reflow oven
In order to realize the control of wind speed and air volume, two points need to be paid attention to: The speed of the fan should be controlled by frequency conversion to reduce the influence of voltage fluctuation on it; Minimize the exhaust air volume of the equipment, because the central loa...Read more -
What new requirements does the increasingly mature lead-free process put on the reflow oven?
What new requirements does the increasingly mature lead-free process put on the reflow oven? We analyze from the following aspects: l How to obtain a smaller lateral temperature difference Since the lead-free soldering process window is small, the control of the lateral temperature difference is...Read more -
The increasingly mature lead-free technology requires reflow soldering
According to the EU’s RoHS Directive (Directive Act of the European Parliament and the Council of the European Union on the restriction of the use of certain hazardous substances in electrical and electronic equipment), The directive requires the ban on the EU market to sell electronic and ...Read more -
Solder paste printing solution for miniaturized components 3-3
1) Electroforming stencil The manufacturing principle of the electroformed stencil: the electroformed template is made by printing the photoresist material on the conductive metal base plate, and then through the masking mold and ultraviolet exposure, and then the thin template is electroformed i...Read more -
Solder paste printing solution for miniaturized components 3-2
To understand the challenges brought by miniaturized components to solder paste printing, we must first understand the area ratio of stencil printing (Area Ratio). For the solder paste printing of miniaturized pads, the smaller the pad and the stencil opening, the more difficult it is for the so...Read more -
Solder paste printing solution for miniaturized components 3-1
In recent years, with the increase in the performance requirements of smart terminal devices such as smart phones and tablet computers, the SMT manufacturing industry has a stronger demand for miniaturization and thinning of electronic components. With the rise of wearab...Read more -
Selective Soldering Oven Inside System
1. Flux spraying system Selective wave soldering adopts a selective flux spraying system, that is, after the flux nozzle runs to the designated position according to the programmed instructions, only the area on the circuit board that needs to be soldered is sprayed wit...Read more -
Reflow soldering principle
The reflow oven is used to solder the SMT chip components to the circuit board in the SMT process soldering production equipment. The reflow oven relies on the hot air flow in the furnace to brush the solder paste on the solder joints of the solder paste circuit b...Read more
