News
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What Are The Characteristics of Wave Soldering Machine Process?
1. Wave Soldering Machine Technological process Dispensing → patch → curing → wave soldering 2. Process characteristics The size and filling of the solder joint depend on the design of the pad and the installation gap between the hole and the lead. The amount of heat applied to the PCB depends ma...Read more -
What Is Pick and Place Machine?
What is pick and place machine? Pick and place machine is the key and complex equipment in SMT production, which is used to attach components with high speed and high precision. Now the pick and place machine has developed from early low speed mechanical SMT machine to high speed optical centerin...Read more -
What Are Factors Affecting The Quality of Solder Paste Printing?
1. Solder paste printing machine scraper type: solder paste printing according to the characteristics of the solder paste or red glue to choose the appropriate scraper, most of the mainstream scraper is made of stainless steel. 2. Scraper Angle: the Angle of the scraper scraping tin paste, genera...Read more -
What Are The Causes of Solder Beading Produced During SMT Processing?
Sometimes there will be some poor processing phenomenon in the process of SMT machine, tin bead is one of them, to solve the problem, we must first know the cause of the problem. Solder beading is in the solder paste slump or in the process of pressing out of the pad occurs. During reflow oven so...Read more -
How to Use Manual Stencil Printer?
The operation process of manual solder paste printer mainly includes putting plate, positioning, printing, taking plate and cleaning steel mesh. 1. Secure the steel net Use the fixing device to fix the steel net on the printing machine. After the fixing, ensure that the steel net and PCB are in f...Read more -
Precautions for Using SMT Components
Environmental conditions for storage of surface assembly components: 1. Ambient temperature: storage temperature <40℃ 2. Production site temperature <30℃ 3. Ambient humidity : < RH60% 4. Environmental atmosphere: no toxic gases such as sulfur, chlorine and acid that affect the welding pe...Read more -
What Is The Impact of Incorrect PCBA Board Design?
1. The process side is designed on the short side. 2. Components installed near the gap may be damaged when the board is cut. 3. PCB board is made of TEFLON material with thickness of 0.8mm. The material is soft and easy to deform. 4. PCB adopts V-cut and long slot design process for transmission...Read more -
Electronics and Instrumentation RADEL 2021
NeoDen official RU distributor- LionTech will attend Electronics and Instrumentation RADEL Show. Booth Number: F1.7 Date: 21th-24th September 2021 City: Saint-Petersburg Welcome to have the first experience at the booth. Exhibition Sections Printed circuit boards: single-side PCB double-sided PC...Read more -
What Sensors Are on The SMT machine?
1. Pressure sensor of SMT machine Pick and place machine, including various cylinders and vacuum generators, have certain requirements for air pressure, lower than the pressure required by the equipment, the machine can not operate normally. Pressure sensors always monitor pressure changes, once ...Read more -
How To Weld Double-sided Circuit Boards?
I. Double-sided circuit board characteristics The difference between single-sided and double-sided circuit boards is the number of layers of copper. Double-sided circuit board is a circuit board with copper on both sides, which can be connected through holes. And there is only one layer of copper...Read more -
What is Entry-level SMT Assembly Line?
NeoDen provide one-stop SMT assembly line. What is Entry-level SMT Assembly Line? Stencil printer, SMT machine, reflow oven. Stencil printer FP2636 NeoDen FP2636 is a manual stencil printer that is easy to use for beginners. 1. T screw rod regulating handle,ensure adjustment accuracy and leveln...Read more -
What Are The Solutions to PCB Bending Board and Warping Board?
NeoDen IN6 1. Reduce the temperature of reflow oven or adjust the rate of heating and cooling of the plate during reflow soldering machine to reduce the occurrence of plate bending and warping; 2. The plate with higher TG can withstand higher temperature, increase the ability to withstand pressur...Read more
