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  • What knowledge is needed to design PCB boards?

    What knowledge is needed to design PCB boards?

    1. Preparation Including the preparation of component libraries and schematics. Before the PCB design, first prepare the schematic SCH component library and PCB component package library. PCB component package library is best established by engineers based on the standard size information of the ...
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  • PCB Layout Design Considerations

    PCB Layout Design Considerations

    In order to facilitate production, PCB stitching generally need to design Mark point, V-slot, process edge. I. The shape of the spelling plate 1. The outer frame of the PCB splicing board (clamping edge) should be closed-loop design to ensure that the PCB splicing board will not be deformed after...
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  • What is the classification of Smt mounter placement head?

    What is the classification of Smt mounter placement head?

    Mounting head is also called as suction nozzle, it is the most complex and core part of the program application and components on the mounting machine. If compared to a person, it is equivalent to a human hand. Because in the placement processing components placed on the PCB board action is neede...
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  • How to Avoid The Error of Pick and Place Machine?

    How to Avoid The Error of Pick and Place Machine?

    Automatic pick and place machine is a very precise automatic production equipment. The way to prolong the service life of automatic SMT machine is to maintain the automatic pick and place machine strictly and have the corresponding operating procedures and related requirements for the automatic p...
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  • What Are The Important PCB Routing Rules That Should be Followed When Using High-speed Converters?

    Should the AGND and DGND ground layers be separated? The simple answer is that it depends on the situation, and the detailed answer is that they are usually not separated. Because in most cases, separating the ground layer will only increase the inductance of the return current, which brings more...
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  • What Are The 6 Key Steps in Chip Manufacturing?

    What Are The 6 Key Steps in Chip Manufacturing?

    In 2020, more than a trillion chips were produced worldwide, which equates to 130 chips owned and used by each person on the planet. Yet even so, the recent chip shortage continues to show that this number has not yet reached its upper limit. Although chips can already be produced on such a large...
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  • What Is HDI Circuit Board?

    What Is HDI Circuit Board?

    I. What is HDI board? HDI board (High Density Interconnector), that is, high-density interconnect board, is the use of micro-blind buried hole technology, a circuit board with a relatively high density of line distribution. HDI board has an inner line and outer line, and then the use of drilling,...
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  • MOSFET Device Selection of The 3 Major Rules

    MOSFET Device Selection of The 3 Major Rules

    MOSFET device selection to consider all aspects of factors, from small to choose N-type or P-type, package type, large to MOSFET voltage, on-resistance, etc., different application requirements vary. The following article summarizes the MOSFET device selection of the 3 major rules, I believe that...
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  • How To Transport and Store PCBA?

    How To Transport and Store PCBA?

    In order to ensure the quality of PCBA, each processing link of PCBA placement and plug-in function test must be strictly controlled, and the transportation and storage of PCBA is no exception, because in the process of transportation and storage, if the protection is not proper, it may cause the...
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  • LED Expo Mumbai 2022 Exhibition

    LED Expo Mumbai 2022 Exhibition

    NeoDen India distributor-ChipMax will attend LED Expo Mumbai 2022 Exhibition Welcome to have the first experience at the booth Booth Number: J12 Date: 19-21 May 2022 City: Mumbal Web: http://neodenindia.com/index.php   LED Expo Mumbai 2022: Event Profile LED Expo Mumbai 2022 is India’s onl...
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  • What are the advantages of automatic wave soldering?

    What are the advantages of automatic wave soldering?

    Suitable for high productivity lead-free process requirements. Self-developed tenth generation intelligent control software, process making, curve chart, product technology, automatic heating function. The noise of the equipment is below 60 decibels. Automatic positioning spraying and tin sprayi...
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  • A New Way to Quickly Create Structures in IC Packages

    A New Way to Quickly Create Structures in IC Packages

    In the latest SPB 17.4 release, the Allegro® Package Designer Plus tool ushers in a new twist in wiring technology – the popular concept of “over-hole structures” has been renamed “structures” because of its increasing flexibility and applicability to many different ...
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