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  • Classification of Surface Mount Capacitors

    Classification of Surface Mount Capacitors

    Surface mount capacitors have developed into many varieties and series, classified by shape, structure and usage, which can reach hundreds of kinds. They are also called chip capacitors, chip capacitors, with C as the circuit representation symbol. In the SMT SMD practical applications, about 80%...
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  • The Importance of Tin-lead Solder Alloys

    The Importance of Tin-lead Solder Alloys

    When it comes to printed circuit boards, we cannot forget the important role of auxiliary materials. Currently, the most commonly used tin-lead solder and lead-free solder. The most famous is 63Sn-37Pb eutectic tin-lead solder, which has been the most important electronic soldering material for n...
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  • Analysis of Electrical Fault

    Analysis of Electrical Fault

    A variety of good and bad electrical failure from the probability of the size of the following cases. 1. Poor contact. Board and slot poor contact, the internal fracture of the cable does not work when it passes, the line plug and terminal contact is not good, components such as false welding are...
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  • Chip Component Pad Design Defects

    Chip Component Pad Design Defects

    1. 0.5mm pitch QFP pad length is too long, resulting in short circuit. 2. PLCC socket pads are too short, resulting in false soldering. 3. IC’s pad length is too long and the amount of solder paste is large resulting in short circuit at reflow. 4. Wing-shaped chip pads are too long to affec...
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  • Wave Soldering Surface Components Layout Design Requirements

    Wave Soldering Surface Components Layout Design Requirements

    I. Background description Wave soldering machine welding is through the molten solder on the component pins for the application of solder and heating, due to the relative movement of the wave and PCB and molten solder “sticky”, wave soldering process is much more complex than reflow s...
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  • Tips for Selecting Chip Inductors

    Tips for Selecting Chip Inductors

    Chip inductors, also known as power inductors, are one of the most commonly used components in electronic products, featuring miniaturization, high quality, high energy storage and low resistance. It is often purchased in PCBA factories. When selecting a chip inductor, the performance parameters ...
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  • How to Set Parameters of Solder Paste Printing Machine?

    How to Set Parameters of Solder Paste Printing Machine?

    Solder paste printing machine is an important equipment in the front section of SMT line, mainly using the stencil to print the solder paste on the specified pad, the good or bad solder paste printing, directly affect the final solder quality. The following to explain the technical knowledge of t...
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  • Method for Quality Inspection of PCB

    Method for Quality Inspection of PCB

    1. X – ray pick up check After the circuit board is assembled, X-ray machine can be used to see the BGA underbelly hidden solder joints bridging, open, solder deficiency, solder excess, ball drop, loss of the surface, popcorn, and most often holes. NeoDen X Ray Machine X-Ray Tube Source Spe...
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  • Advantages of PCB Assembly Prototyping for Rapid Construction of New Products

    Advantages of PCB Assembly Prototyping for Rapid Construction of New Products

    Before starting a full production run, you need to make sure your PCB is up and running. After all, when a PCB fails after full production, you can’t afford costly mistakes or, worse, faults that can be detected even after you put the product on the market. Prototyping ensures early elimina...
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  • What Are The Causes and Solutions of PCB Distortion?

    What Are The Causes and Solutions of PCB Distortion?

    PCB distortion is a common problem in PCBA batch production, which will bring considerable influence to assembly and testing. How to avoid this problem, please see below. The causes of PCB distortion are as follows: 1. Improper selection of PCB raw materials, such as low T of PCB, especially pape...
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  • Requirements for The Layout Design of Components for Wave Soldering Surface

    Requirements for The Layout Design of Components for Wave Soldering Surface

    1. Background Wave soldering is applied and heated by molten solder to the pins of components. Due to the relative movement of wave crest and PCB and the “stickiness” of molten solder, the wave soldering process is much more complex than reflow welding. There are requirements for pin ...
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  • 6 Limitations of Selective Wave Soldering Machine

    6 Limitations of Selective Wave Soldering Machine

    Selective wave soldering machine provides a new welding method, which has incomparable advantages over manual welding, traditional wave soldering machine and through-hole reflow oven. However, no welding method can be perfect, and selective wave soldering also has some “limitations” d...
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