News

  • What Are the Configuration and Considerations in COFT Control Mode?

    What Are the Configuration and Considerations in COFT Control Mode?

    LED driver chip introduction with the rapid development of the automotive electronics industry, high-density LED driver chips with wide input voltage range are widely used in automotive lighting, including exterior front and rear lighting, interior lighting and display backlighting. LED driver ch...
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  • What Are The Technical Points of Selective Wave Soldering?

    What Are The Technical Points of Selective Wave Soldering?

    Flux spraying system Selective wave soldering machine flux spraying system is used for selective soldering, i.e. the flux nozzle runs to the designated position according to the pre-programmed instructions and then only fluxes the area on the board that needs to be soldered (spot spraying and lin...
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  • 14 Common PCB Design Erors and Reasons

    14 Common PCB Design Erors and Reasons

    1. PCB no process edge, process holes, can not meet the SMT equipment clamping requirements, which means that it can not meet the requirements of mass production. 2. PCB shape alien or size too large, too small, the same can not meet the requirements of equipment clamping. 3. PCB, FQFP pads aroun...
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  • How to Maintain The Solder Paste Mixer?

    How to Maintain The Solder Paste Mixer?

    The solder paste mixer can effectively mix the solder powder and flux paste. The solder paste is removed from the refrigerator without the need to reheat the paste, eliminating the need for reheating time. The water vapor also dries naturally during the mixing process, reducing the chance of abso...
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  • Chip Component Pad Design Defects

    Chip Component Pad Design Defects

    1. 0.5mm pitch QFP pad length is too long, causing short circuit. 2. PLCC socket pads are too short, resulting in false soldering. 3. Pad length of IC is too long and the amount of solder paste is large causing short circuit at reflow. 4. Wing chip pads are too long affecting heel solder filling ...
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  • The Discovery of PCBA Virtual Soldering Problem Method

    The Discovery of PCBA Virtual Soldering Problem Method

    I. The common reasons for the generation of false solder are 1. Solder melting point is relatively low, the strength is not large. 2. The amount of tin used in welding is too small. 3. Poor quality of the solder itself. 4. Component pins exist stress phenomenon. 5. Components generated by the hig...
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  • Holiday Notice from NeoDen

    Holiday Notice from NeoDen

    Quick facts about NeoDen ① Established in 2010, 200+ employees, 8000+ Sq.m. factory ② NeoDen products: Smart series PNP machine, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, Solder paste printer FP2636, PM3040 ③ Successful 10000+ customers acr...
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  • How to Solve The Common Problems in PCB Circuit Design?

    How to Solve The Common Problems in PCB Circuit Design?

    I. The pad overlap 1. The overlap of pads (in addition to surface paste pads) means that the overlap of holes, in the drilling process will lead to broken drill bit because of multiple drilling in one place, resulting in damage to the hole. 2. Multilayer board in two holes overlap, such as a hole...
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  • What Are The Methods to Improve PCBA Board Soldering?

    What Are The Methods to Improve PCBA Board Soldering?

    In the process of PCBA processing, there are many production processes, which are easy to produce many quality problems. At this time, it is necessary to constantly improve the PCBA welding method and improve the process to effectively improve the product quality. I. Improve the temperature and t...
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  • Circuit Board Thermal Conductivity and Heat Dissipation Design Processability Requirements

    Circuit Board Thermal Conductivity and Heat Dissipation Design Processability Requirements

    1. Heat sink shape, thickness and area of the design According to the thermal design requirements of the required heat dissipation components should be fully considered, must ensure that the junction temperature of the heat-generating components, PCB surface temperature to meet product design req...
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  • What Are The Steps for Spraying The Three-proof Paint?

    What Are The Steps for Spraying The Three-proof Paint?

    Step 1: Clean the board surface. Keep the board surface free of oil and dust (mainly flux from the solder left in the reflow oven process). Because this is mainly acidic material, it will affect the durability of the components and the adhesion of the three-proof paint with the board. Step 2: Dry...
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  • Safety Measures for Manual Soldering

    Safety Measures for Manual Soldering

    Manual soldering is the most common process in SMT processing lines. But the welding process should pay attention to some safety measures in order to work more efficiently. Staff need to pay attention to the following points: 1. Due to the distance from the soldering iron head 20 ~ 30cm at the co...
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