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  • What Are The 6 Key Steps in Chip Manufacturing?

    What Are The 6 Key Steps in Chip Manufacturing?

    In 2020, more than a trillion chips were produced worldwide, which equates to 130 chips owned and used by each person on the planet. Yet even so, the recent chip shortage continues to show that this number has not yet reached its upper limit. Although chips can already be produced on such a large...
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  • What Is HDI Circuit Board?

    What Is HDI Circuit Board?

    I. What is HDI board? HDI board (High Density Interconnector), that is, high-density interconnect board, is the use of micro-blind buried hole technology, a circuit board with a relatively high density of line distribution. HDI board has an inner line and outer line, and then the use of drilling,...
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  • MOSFET Device Selection of The 3 Major Rules

    MOSFET Device Selection of The 3 Major Rules

    MOSFET device selection to consider all aspects of factors, from small to choose N-type or P-type, package type, large to MOSFET voltage, on-resistance, etc., different application requirements vary. The following article summarizes the MOSFET device selection of the 3 major rules, I believe that...
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  • How To Transport and Store PCBA?

    How To Transport and Store PCBA?

    In order to ensure the quality of PCBA, each processing link of PCBA placement and plug-in function test must be strictly controlled, and the transportation and storage of PCBA is no exception, because in the process of transportation and storage, if the protection is not proper, it may cause the...
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  • LED Expo Mumbai 2022 Exhibition

    LED Expo Mumbai 2022 Exhibition

    NeoDen India distributor-ChipMax will attend LED Expo Mumbai 2022 Exhibition Welcome to have the first experience at the booth Booth Number: J12 Date: 19-21 May 2022 City: Mumbal Web: http://neodenindia.com/index.php   LED Expo Mumbai 2022: Event Profile LED Expo Mumbai 2022 is India’s onl...
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  • What are the advantages of automatic wave soldering?

    What are the advantages of automatic wave soldering?

    Suitable for high productivity lead-free process requirements. Self-developed tenth generation intelligent control software, process making, curve chart, product technology, automatic heating function. The noise of the equipment is below 60 decibels. Automatic positioning spraying and tin sprayi...
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  • A New Way to Quickly Create Structures in IC Packages

    A New Way to Quickly Create Structures in IC Packages

    In the latest SPB 17.4 release, the Allegro® Package Designer Plus tool ushers in a new twist in wiring technology – the popular concept of “over-hole structures” has been renamed “structures” because of its increasing flexibility and applicability to many different ...
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  • Why SMT needs a reflow oven tray with a full carrier?

    Why SMT needs a reflow oven tray with a full carrier?

    SMT reflow oven is an essential soldering equipment in the SMT process, which is actually a combination of a baking oven. Its main function is to let the paste solder in the reflow oven, the solder will be melted at high temperatures after the solder can make the SMD components and circuit boards...
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  • How to Optimize PCB Design?

    How to Optimize PCB Design?

    1. Figure out which are the programmable devices on the board. The devices on the board are not all programmable within the system. For example, parallel devices are usually not allowed to do so. For programmable devices, the serial programming capability of the ISP is essential to maintain desig...
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  • The 4 Characteristics of Radio-frequency Circuits

    The 4 Characteristics of Radio-frequency Circuits

    This article explains the 4 basic characteristics of RF circuits from four aspects: RF interface, small expected signal, large interference signal, and interference from adjacent channels, and gives important factors that need special attention in the PCB design process. RF circuit simulation of ...
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  • The Main Points of Wave Soldering Operation

    The Main Points of Wave Soldering Operation

    I. Wave soldering machine temperature control Refers to the nozzle outlet temperature of the solder wave. General temperature control at 230 – 250 ℃, the temperature is too low will make the solder joint rough, pull, not bright. Even cause false solder, false solder; temperature is too high...
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  • Workflow of Wave Soldering Machine

    Workflow of Wave Soldering Machine

    1. Spray no-clean flux to the circuit board Has been inserted into the completed components of the circuit board, it will be embedded in the jig, from the machine at the entrance of the splicing device to a certain angle of inclination and transmission speed into the wave soldering machine, and t...
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