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PCB design process
The general PCB basic design process is as follows: Pre-preparation → PCB structure design → guide network table → rule setting → PCB layout → wiring → wiring optimization and screen printing → network and DRC check and structure check → output light painting → light painting review → PCB board p...Read more -
IGBT Narrow Pulse Phenomenon Explained
What is Narrow Pulse Phenomenon As a kind of power switch, IGBT needs a certain reaction time from the gate level signal to the device switching process, just as it is easy to squeeze the hand too fast in life to switch the gate, too short opening pulse may cause too high voltage spikes or high f...Read more -
NeoDen in ElectronTechExpo 2022
19th International Exhibition ElectronTechExpo 2022 took place April 12-14 in Moscow. During 3 days of exhibition the participants showed new equipment models and most relevant offers for your business. LionTech company took part in the event and presented electronics manufacturing equipment. Thi...Read more -
What Are The Resistor Parameters?
There are many parameters of the resistor, usually we are generally concerned about the value, accuracy, amount of power, these three indicators are appropriate. It is true that in digital circuits, we do not need to pay attention to too many details, after all, there are only 1 and 0 inside the ...Read more -
How to Expand IGBT Driver Current?
Power semiconductor driver circuit is an important subcategory of integrated circuits, powerful, used for IGBT driver ICs in addition to providing drive level and current, often with drive protection functions, including desaturation short circuit protection, undervoltage shutdown, Miller clamp, ...Read more -
Anti-deformation installation of printed circuit board components
1. In the reinforcement frame and PCBA installation, PCBA and chassis installation process, the warped PCBA or warped reinforcement frame implementation of direct or forced installation and PCBA installation in the deformed chassis. Installation stress causes damage and breakage of component lead...Read more -
PCBA Processing Pads Are Not on The Tin Reason Analysis
PCBA processing is also known as chip processing, more upper layer is called SMT processing, SMT processing, including SMD, DIP plug-in, post-solder test and other processes, the title of the pads are not on the tin is mainly in the SMD processing link, a paste full of various components of the b...Read more -
What knowledge is needed to design PCB boards?
1. Preparation Including the preparation of component libraries and schematics. Before the PCB design, first prepare the schematic SCH component library and PCB component package library. PCB component package library is best established by engineers based on the standard size information of the ...Read more -
PCB Layout Design Considerations
In order to facilitate production, PCB stitching generally need to design Mark point, V-slot, process edge. I. The shape of the spelling plate 1. The outer frame of the PCB splicing board (clamping edge) should be closed-loop design to ensure that the PCB splicing board will not be deformed after...Read more -
What is the classification of Smt mounter placement head?
Mounting head is also called as suction nozzle, it is the most complex and core part of the program application and components on the mounting machine. If compared to a person, it is equivalent to a human hand. Because in the placement processing components placed on the PCB board action is neede...Read more -
How to Avoid The Error of Pick and Place Machine?
Automatic pick and place machine is a very precise automatic production equipment. The way to prolong the service life of automatic SMT machine is to maintain the automatic pick and place machine strictly and have the corresponding operating procedures and related requirements for the automatic p...Read more -
What Are The Important PCB Routing Rules That Should be Followed When Using High-speed Converters?
Should the AGND and DGND ground layers be separated? The simple answer is that it depends on the situation, and the detailed answer is that they are usually not separated. Because in most cases, separating the ground layer will only increase the inductance of the return current, which brings more...Read more
