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DIP Wave Soldering Machine Process Flow
1. Plug-in There are AI automatic plug-in machine, but also manual plug-in, mainly some high, large points, the need for through-hole capacitors, resistors, inductors 2. Wave soldering machine After the completion of the plug-in, the need to go through the wave soldering, through-hole components ...Read more -
Notes during the operation of the SMT machine
SMT machine is the most critical and core equipment of SMT assembly line. Whether the normal work of the pick and place machine directly affects the operation of the production line of the patching plant, so in the usual production process, must be diligent maintenance, so that the SMT machine to...Read more -
What Are The Components of PCB?
1. Pads. The pad is the metal hole used to solder the pins of the components. 2. Layer. Circuit board according to the design of the different, there will be double-sided, 4-layer board, 6-layer board, 8-layer board, etc., the number of layers are generally double, in addition to go signal layer,...Read more -
Steps for Solder Paste Printing Machine Working
1. PCB boards are fed into the solder paste printer along the conveyor belt. 2. The machine finds the main edge of the PCB and positions it. 3. The Z-frame moves up to the position of the vacuum board. 4. Add vacuum and fix the PCB firmly in the specific position. 5. Visual axis (lens) slowly mov...Read more -
The process of PCBA repair
Generally we patch processing factory in the maintenance technology yuan will carry out the following operations. 1. Check the components In SMT chip processing plant in the product needs to be repaired when the first thing to determine, the components of each solder point there is no error, leak...Read more -
What are the six principles of PCB wiring?
Zhejiang NeoDen Technology Co., LTD., founded in 2010, is a professional manufacturer specialized in SMT mounting machine, reflow oven, stencil printer, SMT production line and other SMT Products. We have our own R & D team and own factory, taking advantage of our own rich experienced R&D...Read more -
What does the accuracy of the SMD processing refer to?
In the process of PCBA processing, the accuracy of SMT mounting machine can be roughly divided into several parameters such as positioning accuracy, repetition accuracy and resolution. Here is a brief introduction to the common precision meaning of pick and place machine china. 1.Positioning acc...Read more -
How is the vision system of SMT machine composed?
In SMD mounting machine vision system we can more accurately determine the current components, circuit boards or SMT suction nozzle position, rely on the visual recognition system we can provide more accurate placement for the placement machine then you understand how this system is composed of? ...Read more -
NeoDen in Summer NAMM Show 2022
We’re at Summer NAMM 2022 with the brand new NeoDen9 pick and place machine! Come check out a demo, North Hall, booth 15714. June 3–5 Summer NAMM 2022 in Los Angeles! Our US agent NeoDen USA take part in this exhibition and attracted a lot electronics enthusiasts’ attention. It Left ...Read more -
Process flow of SMT placement
SMT is surface mount technology, is currently the most popular technology and process in the electronic assembly industry. SMT placement refers to a series of processes based on the PCB for short. PCB means printed circuit board. Process SMT basic process components: solder paste printing –...Read more -
Details of various packages for semiconductors (2)
41. PLCC (plastic leaded chip carrier) Plastic chip carrier with leads. One of the surface mount package. The pins are led out from the four sides of the package, in the shape of a ding, and are plastic products. It was first adopted by Texas Instruments in the United States for 64k-bit DRAM and ...Read more -
Details of various packages for semiconductors (1)
1. BGA(ball grid array) Ball contact display, one of the surface mount type packages. Ball bumps are made on the back of the printed substrate to replace the pins in accordance with the display method, and the LSI chip is assembled on the front of the printed substrate and then sealed with molded...Read more
