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PCB Processing Process Requirements
PCB is mainly to power supply processing of the main board, its processing process is basically not complicated, mainly SMT machine placement, wave soldering machine welding, manual plug-in, etc., power control board in the process of SMD processing, the main process requirements are as follows. ...Read more -
How to control the wave soldering machine height to reduce dross?
In the wave soldering machine soldering stage, the PCB must be immersed in the wave will be coated with solder on the solder joint, so the height of the wave control is a very important parameter. Proper adjustment of wave height so that the wave of solder on the solder joint to increase the pres...Read more -
What is Nitrogen Reflow Oven?
Nitrogen reflow soldering is the process of filling the reflow chamber with nitrogen gas in order to block the entry of air into the reflow oven to prevent oxidation of the component feet during reflow soldering. The use of nitrogen reflow is mainly to enhance the quality of soldering, so that th...Read more -
NeoDen in the Automation Expo 2022 in Mumbai
Our official Indian distributor takes the new product- pick and place machine NeoDen YY1 at the exhibition, welcome to visit stall F38-39, Hall No.1. YY1 is featured with automatic nozzle changer, support short tapes, bulk capacitors and support max. 12mm height components. Simple structure and f...Read more -
SMT Chip Processing of Bulk Material Handling Briefly
It is necessary to standardize the process of bulk material handling in the production process of SMT SMT processing, and effective control of bulk material can avoid the bad processing phenomenon caused by bulk material. What is bulk material? In SMT processing, loose material is generally defin...Read more -
Manufacturing Process of Rigid-Flexible PCBs
Before the manufacturing of rigid-flexible boards can begin, a PCB design layout is required. Once the layout is determined, manufacturing can begin. The rigid-flexible manufacturing process combines the manufacturing techniques of rigid and flexible boards. A rigid-flexible board is a stack of r...Read more -
Why is component placement so important?
PCB design 90% in the device layout, 10% in the wiring, this is indeed a true statement. Starting to go to the trouble of placing the devices carefully can make a difference and improve the electrical characteristics of the PCB. If you just put the components on the board haphazardly, what will h...Read more -
What is the reason for the empty welding of the components?
SMD will have a variety of quality defects occur, for example, the component side of the warped empty solder, the industry called this phenomenon for the monument. One end of the component warped thus causing the monument empty solder, is a variety of reasons for the formation of. Today, we will ...Read more -
What are the BGA welding quality inspection methods?
How to determine the quality of BGA welding, with what equipment or what testing methods? The following to tell you about the BGA welding quality inspection methods in this regard. BGA welding unlike the capacitor-resistor or external pin class IC, you can see the quality of welding on the outsid...Read more -
What Factors Affect Solder Paste Printing?
The main factors that affect the filling rate of solder paste are printing speed, squeegee angle, squeegee pressure and even the amount of solder paste supplied. In simple terms, the faster the speed and the smaller the angle, the greater the force downward of the solder paste and the easier it i...Read more -
Requirements for layout design of reflow welded surface elements
Reflow soldering machine has a good process, there is no special requirements for the layout of components location, direction and spacing. Reflow soldering surface components layout mainly consider solder paste printing stencil open window to components spacing requirements, check and return to ...Read more -
Why the capacitor will stand monument false solder?
1.The problem of solder paste printing In the time of solder paste printing, because the solder paste printing is not flat, one end solder paste quantity is more, one end solder paste quantity is less, lead to reflow oven soldering hot melt appear time inconsistent, tension size is uneven, one en...Read more
