News
-
What are the solutions to the high material throwing rate of the chip machine?
Chip machine throwing material is a bad production of the chip machine phenomenon, different brands of chip machine throwing material rate have a reasonable range, beyond a reasonable range, it is necessary to check and solve the problem of high throwing material rate. General placement machine t...Read more -
Temperature and humidity-sensitive components storage and use
Electronic components are the main materials for chip processing, some components and common different, need special storage to ensure that no problems, temperature and humidity sensitive components is one of them. Temperature and humidity sensitive components management storage in the processing...Read more -
Classification of Packaging Defects (II)
5. Delamination Delamination or poor bonding refers to the separation between the plastic sealer and its adjacent material interface. Delamination can occur in any area of a molded microelectronic device; it can also occur during the encapsulation process, post-encapsulation manufacturing phase, ...Read more -
Classification of Packaging Defects (I)
Packaging defects mainly include lead deformation, base offset, warpage, chip breakage, delamination, voids, uneven packaging, burrs, foreign particles and incomplete curing, etc. 1. Lead deformation Lead deformation usually refers to the lead displacement or deformation caused during the flow of...Read more -
Printed Circuit Board Manufacturing
There are five standard technologies used in printed circuit board manufacturing. 1. Machining: This includes drilling, punching and routing holes in the printed circuit board using standard existing machinery, as well as new technologies such as laser and water jet cutting. The strength of the b...Read more -
BGA Packaging Process Flow
Substrate or intermediate layer is a very important part of BGA package, which can be used for impedance control and for inductor/resistor/capacitor integration in addition to interconnect wiring. Therefore, the substrate material is required to have high glass transition temperature rS (about 17...Read more -
How to Do If Air Pressure of The SMT Machine Is Not Enough?
Anyone who uses a SMT machine knows that the pressure is a very important part of the machine. In using a SMT machine, not only do you need voltage, but you also need pressure to help use it. Sometimes we will find that pick and place machine is not getting enough pressure. What do we do if there...Read more -
Semicon Korea 2023 Exhibition
NeoDen official Korean distributor—- 3H CORPORATION LTD. took the new product- small desktop pick& place machine YY1 at the exhibition, welcome to visit booth C228. YY1 is featured with automatic nozzle changer, support short tapes, bulk capacitors and support max. 12mm height compone...Read more -
NeoDen’s Recent Customer Feedback
Customer1: Your NeoDen YY1 has arrived at our place, we are very happy =) Customer2: YY1 is very good machine. Where I can send order for 1 pcs? with its strengths, YY1 pick and place machine attracts many SMT industry enthusiasts and the heat of enquiries and sales is unrelenting. At the...Read more -
SMT printing even tin the causes and solutions
SMT processing will appear some bad quality problems, such as standing monument, even tin, empty solder, false solder, etc.. There are many reasons for poor quality, if there is a need for specific analysis of specific problems. Today with you to introduce the SMT printing even tin the causes and...Read more -
SMT machine use common problems and solutions
We may encounter in the process of using pick and place machine can not operate normally, the situation we start not to worry, check the power supply connection, because it is possible that your power plug is not plugged in. of course, there may be voltage problems, the biggest problem is the equ...Read more -
The Importance of Electronic Assembly Technology
The most frequent and costly quality problems with electronic products are not in the process and manufacturing, but in the design, especially in the circuit design. A modern electronics institute or electronics factory with top management who only knows design but not what is process and what is...Read more
