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  • SMT Technology and Process Parameters

    SMT Technology and Process Parameters

    Surface Mount Technology (SMT) is very important in PCBA processing as it allows electronic components to be mounted directly onto the PCB, providing an efficient assembly method. Below is some key information about SMT technology and process parameters: SMT technology overview 1. Component types...
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  • Traceability and Production Records Management for PCBAs

    Traceability and Production Records Management for PCBAs

    Traceability and production records management are critical in PCBA manufacturing, they help ensure product quality, safety and compliance. Here are some key aspects and strategies for traceability and production records management:   Traceability 1. Unique identification Assign a unique ide...
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  • Power consumption optimization and battery management in PCBA design

    Power consumption optimization and battery management in PCBA design

    Power consumption optimization and battery management are critical in PCBA design, especially for embedded systems or portable devices that rely on battery power. Here are some key strategies and tips for power consumption optimization and battery management: Power consumption optimization 1. Sel...
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  • Key points about hot air reflow oven rework process

    Key points about hot air reflow oven rework process

    1. The chip reflow soldering curve should be close to the original welding curve with the chip. Hot air reflow oven curve can be divided into four zones: preheating zone, heating zone, reflow zone, cooling zone, four zones of temperature, time parameters can be set separately, by connecting with ...
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  • How to manage electronic component availability and shortages?

    How to manage electronic component availability and shortages?

    Electronic component availability and shortage management is critical in PCBA processing, as component supply shortages or non-availability can lead to production delays and increased costs. The following are some key strategies and methods for managing electronic component availability and short...
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  • What do we need to pay attention to the quality inspection of stencil printer?

    What do we need to pay attention to the quality inspection of stencil printer?

    In PCBA processing, the quality of solder paste printer is a key factor in determining the quality of PCBA soldering. in order to better standardize the use of solder paste printing machine, we must be familiar with the relevant structure of the solder paste printing machine as well as the workin...
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  • Three elements to improve placement quality

    Three elements to improve placement quality

    I. The correct components Requirements for the assembly of the type, model, nominal value and polarity of the components of the bit number and other characteristics of the mark should be in line with the product’s assembly drawings and detailed list of requirements, can not paste the wrong ...
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  • What is High Density Interconnect Technology?

    What is High Density Interconnect Technology?

    High Density Interconnect Technology is a key technology in PCBA assembly that allows for the integration of more components and electronics in a limited space to improve the performance and functionality of the board. The following are some common applications of high-density interconnect techno...
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  • NeoDen 2023 Year End Promotion Program

    NeoDen 2023 Year End Promotion Program

    In order to thank our overseas customers for their support and trust in NeoDen, we are now launching a year-end promotion program. NeoDen YY1 SMT machine as the core with IN6 reflow oven and FP2636 stencil printer, details as below: I. Promotion Period December 1st, 2023 to December 15th, 2023 II...
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  • Reliability Testing and Life Assessment of PCBA

    Reliability Testing and Life Assessment of PCBA

    Reliability testing and life assessment are critical steps in PCBA assembly, designed to ensure that electronic devices will operate stably and have a reasonable lifespan under varying conditions. The following are the key aspects related to reliability testing and life assessment: 1. Reliability...
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  • What should we need to pay attention to when printing large area circuit boards with Automatic Stencil Printer?

    What should we need to pay attention to when printing large area circuit boards with Automatic Stencil Printer?

    Automatic stencil printer is a kind of equipment commonly used in electronic manufacturing industry, mainly used for printing solder paste to realize the assembly and processing of electronic products. When printing large-area circuit boards, you need to pay attention to the following matters. 1....
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  • How to improve the actual placement rate of SMT placement machines?

    How to improve the actual placement rate of SMT placement machines?

    What is placement rate? The so-called placement rate refers to the ratio of the number of components accurately mounted on the PCB board to the number of components actually picked up by the nozzle in a unit of time. Components picked up by the nozzle that are not accurately mounted on the PCB bo...
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