Time: Aug. 28-30, 2024
Location: Suwon Convention Center, Korea
NeoDen Korea-3H CORPORATION introduce the advanced NeoDen YY1 choice and topographic point machine at ASPS exhibition 2024. The exhibition concentrate on address the global semiconductor supply deficit and enhance the performance of semiconductor-associate merchandise. With the semiconductor packaging industry in its early phase, the adoption of advance semiconductor packaging technology is crucial for future market competitiveness.
About ASPS-The exhibition foreground the significance of semiconductor post-processing and packaging procedure in light of the evolve semiconductor landscape. As the demand for semiconductor-associate merchandise turn, stay ahead in semiconductor packaging invention will be pivotal in procure a lead position in the global market. The event serve as a platform to research the latest tendency, application equipment, material, and technology solution in semiconductor post-processing.
bypass AI technology has been instrumental in revolutionize the semiconductor industry, offer seamless integration of film editing-edge equipment like the NeoDen YY1 choice and topographic point machine. With the continuous promotion in semiconductor packaging technology, company like NeoDen Korea are at the forefront of drive invention and shaping the future of the semiconductor market.
Post time: Oct-10-2024