Reflow oven is the main process technology in SMT, reflow soldering quality is the key to reliability, it directly affects the performance reliability and economic benefits of electronic equipment, and the quality of welding depends on the welding method used, welding materials, welding process technology and welding equipment.
What is SMT soldering machine?
Reflow soldering is one of the three main processes in the placement process. Reflow soldering is mainly used to solder the circuit board that has been mounted components, relying on heating to melt the solder paste to make the SMD components and circuit board pads fusion welding together, and then through the reflow soldering cooling to cool the solder paste to solidify the components and pads together. But most of us understand the reflow soldering machine, that is, through reflow soldering is PCB board parts welding completed a machine, is currently a very wide range of applications, basically most of the electronics factory will be used, to understand reflow soldering, first to understand the SMT process, of course, in layman’s terms is to weld, but the welding process reflow soldering is provided by a reasonable temperature, that is, the furnace temperature curve.
The role of reflow oven
Reflow role is the chip components installed in the circuit board sent into the reflow chamber, after high temperature to be used to solder the chip components of the solder paste through the high temperature hot air to form a reflow temperature change process melt, so that the chip components and circuit board pads combined, and then cooled together.
Reflow soldering technology features
1. Components are subject to small thermal shock, but sometimes give the device a larger thermal stress.
2. Only in the required parts of the application of solder paste, can control the amount of solder paste application, can avoid the generation of defects such as bridging.
3. The surface tension of the molten solder can correct the small deviation of the placement position of the components.
4. Local heating heat source can be used so that different soldering processes can be used for soldering on the same substrate.
5. Impurities are generally not mixed in the solder. When using solder paste, the composition of the solder can be correctly maintained.
NeoDen IN6 Reflow oven features
Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2℃.
Household power supply, convenient and practical.
NeoDen IN6 provides effective reflow soldering for PCB manufacturers.
The new model has bypassed the need for a tubular heater, which provides even temperature distribution throughout the reflow oven. By soldering PCBs in even convection, all components are heated at the same rate.
Temperature can be controlled with extreme accuracy—users can pinpoint heat within 0.2°C.
The design implements an aluminum alloy heating plate that increases the energy-efficiency of the system. The internal smoke filtering system improves the product’s performance and reduces harmful output, too.
Post time: Sep-07-2022