How to Use BGA Rework Station?

Today to give you a brief explanation of the operation of the BGA rework station in the process of what you need to pay attention to, what equipment and basic tools will be used.

I. BGA rework station to keep in mind the following points when using it

1. Prevent over-temperature damage in the process of desoldering, desoldering needs to be adjusted in advance of the hot air gun temperature, the required temperature: (280 ~ 320 ℃), prohibit desoldering to mobilize the temperature.

2. Prevent damage caused by static electricity accumulation, must wear a static electricity hand ring before operation.

3. To prevent damage to the hot air gun desoldering airflow and pressure, desoldering should be adjusted in advance of the hot air gun airflow and pressure, prohibit desoldering when mobilizing airflow and pressure.

4. To prevent damage to the BGA pad on the PCBA, desoldering process can be used tweezers to gently touch the BGA to confirm whether the melt tin, such as melt tin can be removed, such as not melting tin need to continue to heat to melt tin. Note: The operation process should be gently touched, do not force.

5. Pay attention to the positioning and direction of the BGA on the PCBA, to prevent the second planting ball welding.

II. BGA repair in the use of basic equipment and tools

1. Intelligent hot air gun. (for the removal of BGA)

2. Anti-static repair station and electrostatic bracelet. (Before the operation must wear electrostatic bracelet and anti-static maintenance table operation)

3. Anti-static cleaner. (For BGA cleaning)

4. BGA rework station. (for BGA welding)

5. High temperature box (for PCBA board baking)

Auxiliary equipment for: vacuum suction pen, magnifying glass (microscope).

Features of NeoDen 722R BGA Refwork Station

1. Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.

2. Temperature parameters protected by limits of authority, for avoiding error settings.

3. Ten segments of temperature control process, suitable for all kinds of BGA Rework.

4. Unlimited storage of the temperature profile, just need press one key to use the profile.

5. Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.