In the reflow oven welding process, the temperature and speed settings determine the quality of the product. So, what is the basis for reflow soldering speed and temperature settings?
I. According to the temperature curve of the solder paste used for setting. Different alloy composition of the solder paste has a different melting point, even if the same alloy composition, due to the flux composition is different, its activity and activation temperature is not the same. Various solder paste temperature curve is somewhat different, therefore, the specific product temperature and speed and other process parameters should be set to meet the temperature curve provided by the solder paste processing plant.
II. According to the density of SMA mounted components, the size of the components, as well as BGA, CSP and other moisture-sensitive components of the special requirements of the settings. Both to ensure the quality of the solder joints without damaging the components.
III. According to the PCB material, thickness, whether it is a multilayer board, size, set the process parameters to ensure that no damage to the PCB. PCB material (such as FR-4, CEM-1, etc.) will affect the thermal conductivity and thermal expansion, so according to the characteristics of the PCB to adjust the heating curve.
IV. According to the specific conditions of the reflow soldering equipment, such as the length of the heating zone, the material of the heating source, the structure of the reflow soldering oven and heat conduction method and other factors to set.
V. According to the actual location of the reflow temperature sensor to determine the set temperature of the temperature zone.
VI. Based on the size of the reflow oven exhaust air volume to set, and regular measurement.
VII. The ambient temperature on the reflow furnace temperature also has an impact, especially the heating temperature zone is shorter, the narrow width of the reflow furnace, the furnace temperature is affected by the ambient temperature is greater, therefore, in the reflow furnace inlet and outlet to avoid convection wind, so as not to affect the reflow soldering speed and the accuracy of the time settings.
Recommended Temperature Profile
Normally, the recommended temperature profile is divided into the following stages:
Preheating stage: Slowly increase the temperature to allow the PCB and components to adapt to the heat and reduce thermal shock. Typically set at around 150°C.
Wetting phase: critical temperature of the solder is reached, usually between 180°C and 220°C.
Reflow phase: the solder melts and flows evenly, this phase is maintained at 230°C – 260°C.
Cooling phase: rapid cooling to form a strong solder joint.
Features of NeoDen IN8C reflow oven
NeoDen IN8C is a new environmentally friendly, stable performance intelligent automatic orbital reflow soldering.
This reflow solder adopts the exclusive patented design of “even temperature heating plate” design, with excellent soldering performance, with 8 temperature zones compact design, lightweight and compact, to achieve intelligent temperature control, with high-sensitivity temperature sensor, with stable temperature in the furnace, the characteristics of small horizontal temperature difference.
While using Japan NSK hot air motor bearings and Switzerland imported Heating wire, durable and stable performance.
Post time: Jan-15-2025