Introduction
The role of solder paste printing to protect the printed board, improve the quality of soldering and improve the efficiency of assembly, its importance is reflected in the improvement of product quality, reduce manufacturing defects and improve production efficiency.
IV. Common problems and solutions
1. Uneven solder paste printing
Uneven printing of solder paste may lead to insufficient strength of solder joints or false soldering during soldering. This is usually due to the stencil opening design is not reasonable, the squeegee pressure is not set properly or the paste viscosity is too low.
Solution: Optimize the stencil design, adjust the squeegee pressure, and choose the paste with the right viscosity.
2. Too much or too little solder paste
Too much solder paste may lead to bridge phenomenon, that is, two or more should not be connected between the solder paste connection, thus affecting the normal operation of the circuit.
Too little solder paste can result in a weak or empty solder joint, which prevents the solder joints from forming a good electrical connection. This is usually due to poorly designed stencil window size, too large or too small a gap between the steel plate and the PCB.
Solution: According to specific product requirements, the reasonable design of the stencil window size, and adjust the printing parameters.
3. Solder paste printing misalignment
Solder paste printing misalignment may lead to component placement offset, which in turn affects the performance and reliability of the circuit. This is usually due to improper stencil alignment, lack of precision of the printing machine or PCB deformation and other reasons.
Solution: Ensure accurate alignment of the stencil to the PCB, calibrate the printing machine regularly, and check the flatness of the PCB before processing.
4. Solder Paste Collapse
After solder paste printer printing, if the solder paste cannot maintain a stable shape and collapses at the edges, it may lead to a short circuit in soldering. This is usually due to excessive squeegee pressure, paste viscosity is too low, too high a metal content or ambient temperature and other reasons.
Solution: Adjust squeegee pressure, select paste with the right viscosity, control the metal content of the paste, and maintain a suitable ambient temperature.
5. Solder paste contamination
Paste contamination can lead to poor soldering or component damage. This is usually caused by stencils that are not cleaned in a timely manner, worn out wipers, or improper storage of solder paste.
Solution: Clean the stencil and squeegee regularly to ensure that the solder paste is not contaminated during storage and use.
6. Tin beads (tin balls)
Tin beads are individual beads of tin that form during the soldering process and may be attached to pads, pins or anywhere on the PCB. The formation of tin beads may be caused by excessive or uneven printing of solder paste, high soldering temperature, insufficient preheating of the PCB board or oxidation of the metal powder in the solder paste.
Solution: Optimize solder paste printing parameters, control soldering temperature, ensure that the PCB board is fully preheated and select good quality solder paste.
V. Future trends and technologies
1. Automation and intelligence
With the development of automation technology, the solder paste printer will increasingly use automation equipment. This can improve productivity and reduce manual errors while lowering labor costs.
Internet of Things (IoT) technology is used to connect the solder paste printer with other production equipment in the enterprise, realizing real-time data sharing and interconnectivity to form an intelligent manufacturing ecology.
2. New materials and formulations
Innovative solder paste formulations:
New solder paste materials (e.g., lead-free solder paste, low-temperature solder paste, etc.) will continue to emerge. These new materials have better soldering performance and adapt to a wider range of application scenarios.
The development and adoption of solder paste formulations with higher reliability and stability will help improve the strength and durability of solder joints.
Environmentally friendly materials:
With increasingly stringent environmental regulations, developing environmentally friendly solder pastes will become an important trend, and companies will need to focus on the need for sustainable development.
The use of water-soluble or non-toxic materials will reduce the impact on the environment and meet consumer expectations for environmentally friendly products.
3. Precision Printing Technology
Micro fine printing technology:
External market demand for smaller, higher density electronic devices has led to the development of microfine solder paste printing technology, which requires higher precision and control of the printing machine.
The use of advanced stencils and new printing technologies, such as laser cutting and nano-printing, enables high-quality solder paste to be applied on tiny pads.
Conclusion
During the manufacturing process of printed boards, solder paste printing can play a role in protecting the printed boards from scratching or damaging them during handling, and it can also improve the assembly efficiency of components, shorten the manufacturing time, and reduce the manufacturing cost.
Company Profile
① Established in 2010, 200+ employees, 8000+ Sq.m. factory.
② NeoDen products: Smart series PNP machine, NeoDen N10P, NeoDen9, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, IN12C, Solder paste printer FP2636, PM3040.
③ Successful 10000+ customers across the globe.
④ 30+ Global Agents covered in Asia, Europe, America, Oceania and Africa.
⑤ R&D Center: 3 R&D departments with 25+ professional R&D engineers.
⑥ Listed with CE and got 50+ patents.
⑦ 30+ quality control and technical support engineers, 15+ senior international sales, timely customer responding within 8 hours, professional solutions providing within 24 hours.
Post time: Mar-20-2025