Ensure that the SMT machine efficiency and quality, in addition to the equipment itself and the mounter process to start to solve the problem, but also from the material to find a solution, such as circuit boards and SMT components will also affect the SMT machine efficiency and quality. Below from the material to explain to ensure that the machine patch efficiency and quality of the material factors.
1. SMD machine placement of the circuit board line Mark point for the round or square, 1.0mm in diameter, according to the SMT equipment, Mark point to the surrounding copper area needs to be greater than 2.0mm, Mark point does not allow creases, dirty and exposed copper.
2. SMD machine placement of each large circuit board on the four corners must have Mark point or in the opposite corner of the two Mark point, Mark point from the edge of the need to be greater than 5mm.
3. SMT machine patch each piece of small circuit board must have two Mark points.
4. According to the specific mounter equipment and efficiency assessment, FPC circuit board patchwork is not allowed to play “X” board.
5. SMT machine patch board key areas with a wide adhesive paper will be firmly glued to the board and board, and then check the FILM, if the patch board is not flat, must be pressurized again, and then check the FILM once again.
6. SMD machine placement of SMT SMD components 0402 components pad spacing of 0.4mm.
0603 and 0805 components pad spacing of 0.6mm.
Pad is best handled as a square.
7. SMD machine mounting before, in order to avoid the FPC circuit board small area due to the sinking of the area by punching, punching from the bottom direction.
8. The need for SMD machine placement of FPC circuit boards made, must be baked after vacuum packaging.
SMT on-line before, it is best to pre-bake.
9. The need for SMD machine chip board size is best for 200mmX150mm or less.
10. Need to chip machine placement of the circuit board board board edge must be left 4 SMT fixture positioning holes, aperture diameter of 2.0mm.
11. Need to patch machine patchwork circuit board board edge components from the board edge of the minimum distance of 10mm.
12. Need to patch machine patchwork circuit board board distribution as far as possible, each small board is distributed.
13. The need for SMD circuit board small plate gold finger area (i.e., hot press end and can be soldered end) put together a piece, in order to avoid SMT production of the gold finger eat tin.
14. The distance between the pads of the Chip components of the SMD machine patch is 0.5mm minimum.
Features of NeoDen N10P pick and place machine
1. Support PCB within size (L)1500mm*(W)450mm.
2. Automatic nozzle change function has been added to the system. 39 nozzle positions increase the speed and flexibility of integrated placement.
3. IC camera improves the size of IC photos and realizes automatic calibration with automatic nozzle change.
4. Automatic calibration of nozzle height.
5. Increase the convenience of recycling material by adding a throw box.
6. 80 tape feeders to increase the number of simultaneous feeding capacity.
7. Measuring of nozzle air pressure to improve work stability and eliminate obstacles.
8. Optimized software design to improve ease of use and stability.
Post time: Jan-08-2025