Wave soldering machine is a soldering process used in the electronics manufacturing industry to solder components to circuit boards. During the wave soldering process, dross is generated. In order to reduce the generation of dross, it can be controlled by adjusting the wave soldering parameters. Some of the methods that can be tried are shared below:
1. Adjust the preheat temperature and time: preheat temperature is too high or too long will lead to excessive melting and decomposition of the solder, thus producing dross. Therefore, the preheating temperature and time should be adjusted appropriately to ensure that the solder has proper fluidity and solderability.
2. Adjust the amount of flux spray: too much flux spray will lead to excessive wetting of the solder, resulting in the generation of dross. Therefore, the amount of flux spray should be properly adjusted to ensure that the solder has proper wettability.
3. Adjust the soldering temperature and time: too high a soldering temperature or too long a time can lead to excessive melting and decomposition of the solder, resulting in dross. Therefore, the soldering temperature and time should be adjusted appropriately to ensure that the solder has the proper fluidity and solderability.
4. Adjust the wave height: too high a wave height can lead to excessive melting and decomposition of the solder when it reaches the wave peak, resulting in dross. Therefore, the wave height should be properly adjusted to ensure that the solder has the proper speed and solderability.
5. Use dross-resistant solder: Dross-resistant solder specifically designed for wave soldering can reduce the generation of dross. This solder has a special chemical composition and alloy ratio that prevents the solder from decomposing and oxidising on the wave, thus reducing the generation of dross.
It is important to note that these methods may require several attempts and adjustments to find the optimum wave soldering parameters and process conditions. It is also important to follow the relevant standards and specifications of the electronics manufacturing industry to ensure product quality and production safety.
Features of NeoDen Wave Soldering Machine
Model: ND 200
Wave: Duble Wave
PCB Width: Max250mm
Tin tank capacity: 180-200KG
Preheating: 450mm
Wave Height: 12mm
PCB Conveyor Height (mm): 750±20mm
Startup Power: 9KW
Operation Power: 2KW
Tin Tank Power: 6KW
Preheating Power: 2KW
Motor Power: 0.25KW
Control Method: Touch Screen
Machine size: 1400*1200*1500mm
Packing size: 2200*1200*1600mm
Transfer speed: 0-1.2m/min
Preheating Zones: Room temperature-180℃
Heating Method: Hot Wind
Cooling Zone: 1
Cooling method: Axial fan
Solder temperature: Room Temperature—300℃
Transfer Direction: Left→Right
Temperature Control: PID+SSR
Machine Control: Mitsubishi PLC+ Touch Screen
Flux tank capacity: Max 5.2L
Spray Method: Step Motor+ST-6
Power: 3 phase 380V 50HZ
Air source: 4-7KG/CM2 12.5L/Min
Weight: 350KG
Post time: Jun-29-2023