How is the chip mounter inspection adjusted?

When the machine is mounted, the chip mounter needs to determine two things before mounting after sucking up the components.

1. Whether the center of the component and the center of the mounting head are consistent.

This is because the suction nozzle when sucking components due to the location of the components in the package and the location of the mounting head there are errors, and can not be completed to ensure that the suction nozzle sucked in the center of the components. Therefore, before mounting the position must be adjusted to ensure that the center of the component and the mounting head of the position of the center line is accurately centered.

2. Whether the components meet the mounting requirements.

The components provided by the supplier does not guarantee that fully meet the assembly requirements, while components in the transportation, storage, loading and sucking process may cause accidental damage, so in the high degree of automation of the mounter, the use of the mounter system of vision for components “assembly performance” whether the qualified detection function.

The mechanical centering method of the early mounter is no longer used due to the speed limitation and the easy damage of the components due to the mechanical force. Currently, the most widely used inspection methods are optical systems, commonly referred to as vision systems and laser systems.

Camera-based optical systems and laser alignment systems, which utilize the properties of lasers, each have their own characteristics and therefore differ in their use.

Laser alignment allows for “on-the-fly” corrections, has the ability to handle components of all shapes and sizes, and can determine component position and orientation on the spot. However, even sophisticated laser systems cannot measure pins and pin spacing.

Vision systems are capable of determining component position and orientation as well as measuring pins and lead spacing, so most mounters utilize vision positioning systems. Additionally, vision systems offer greater flexibility by being able to adapt to newer component packages without having to adjust the system.

Features of NeoDen10 Pick and place machine

1. Equips double mark camera + double side high precision flying camera ensure high speed and accuracy, real speed up to 13,000 CPH.

Using the real-time calculation algorithm without virtual parameters for speed counting.

2. The magnetic linear encoder system real-time monitor the machine’s accuracy and enables machine to correct error parameter automatically.

3. 8 independent heads with fully closed-loop control system support all 8mm feeder pick up simultaneously, speed up to 13,000 CPH.

4. Programming interface, easy to operate, more intelligent

1.1- click to import coordinates, can identify top/bottom layer

Automatically get the existing component footprint library, factory standard footprint library

2.1- click to add similar footprint library, only need add once, existing footprint library can be automatically identified

3. Upgrade software FOC for life time