Hot air leveling process has the advantages of high efficiency, high precision and wide applicability. By reasonably controlling the hot air temperature, airflow and pressure, it can ensure that the soldering pins are leveled to the target height and improve the soldering quality and reliability. It is a commonly used surface mounting technology that can effectively solve the problem of uneven soldering of electronic components.
I. The principle of the process
1. The role of hot air
Hot air heating the soldering pins, so that it softens and return to its original shape.
2. Airflow regulation
Adjust the airflow speed and temperature of the hot air to control the leveling effect of the welding pins.
3. Pressure contro
Under the action of hot air, the welding pins are leveled to the target height by appropriate pressure.
II. Application Scenario
1. BGA chip leveling
For BGA chips, hot air leveling can make the solder balls uniformly arranged, consistent height, and improve the welding quality.
2. QFN package leveling
For QFN package, hot air leveling can make the welding pins neatly arranged, consistent height, reduce welding defects.
3. TSOP package leveling
For TSOP package, hot air leveling can make the soldering pins neat, not skewed, improve the reliability of soldering.
4. Other components leveling
for other packages of electronic components, such as SMD, hot air leveling can also play a role.
III. Advantage
1. High efficiency
Hot air leveling is fast and can complete the leveling of soldering pins in a short time.
2. High precision
Hot air leveling can make the welding pin leveling to the target height, to ensure the precision and stability of welding.
3. Wide applicability
Hot air leveling is applicable to a variety of packaging forms of electronic components, has a strong generality and applicability.
IV. Cautions
1. Temperature control
Control the temperature of the hot air to avoid excessive temperature causing damage to components or welding pins melting.
2. Airflow regulation
Adjust the airflow speed and direction of the hot air to ensure that the welding pins are leveled evenly.
3. Pressure control
Control the pressure applied during the leveling process to avoid damage or deformation of components caused by excessive pressure.
Quick facts about NeoDen
① Established in 2010, 200+ employees, 8000+ Sq.m. factory
② NeoDen products: Smart series PNP machine, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, Solder paste printer FP2636, PM3040
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Post time: Jun-28-2024