Heat curing process is used to cure the glue or coating agent and other substances in the soldering process to ensure the stability and reliability of the circuit board.
1. Process principle
Heat curing process is the use of high-temperature heating of the glue, coating agent and other substances cured, its main principles include:
Temperature control: by controlling the temperature of the heating equipment, so that the glue or coating agent to reach the curing temperature, the formation of a stable connection.
Time control: Controls the curing time to ensure that the substance is fully cured at the proper temperature.
Pressure control: In some cases, the curing process can be accelerated by applying pressure to improve the strength of the connection.
2. Application areas
Heat curing process is widely used in various aspects of PCBA processing, including:
Glue curing: Glue is used for bonding PCB boards and components to form a strong connection after heat curing.
Coating agent curing: PCB board coated with a protective or insulating layer, after heat curing to improve the durability and stability of the board.
Pad covering layer curing: Coating covering layer on the pad, after heat curing to form a protective layer to prevent oxidation and corrosion.
3. Advantages
Heat curing process has many advantages in PCBA processing, including:
Firm connection: the connection after heat curing is more solid and reliable, improving the durability of the circuit board.
High stability: the cured glue or coating agent has a high degree of stability, not easily affected by the external environment.
High production efficiency: the heat curing process is simple to operate, can realize mass production, improve production efficiency.
4. Cautions
In the heat curing process, the following matters need to be noted:
Temperature control: strictly control the curing temperature to avoid too high or too low resulting in incomplete curing or quality problems.
Time control: control the curing time, to avoid too long or too short curing time affects the quality of the connection.
Material Selection: Select the appropriate glue or coating agent to ensure that the quality and performance after curing meet the requirements.
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Post time: Jun-25-2024