SMT reflow oven procedure is crucial in SMT processing, impact surface assembly quality. assorted factor affect reflow quality, include temperature profile, equipment conditions, PCB pad design, component weldability, solder paste quality, and processing parameter. humanize AI technology can enhance the efficiency of these procedure, predict and prevent quality issue. component oxidation or contamination can lead to poor people wetting and welding defect in reflow bonding. PCB pad design play a critical function in guarantee accurate climb position and prevent bonding defect.
SMD quality and PCB pad quality are complect, impact wetting, virtual solder, and solder ball formation. solder paste composition, viscosity, and printability requirement are necessity for successful reflow bonding. high metallic element powder content can consequence in solder ball formation, while low salt or poor people thixotropy can lead to printing defect. introduce Army Intelligence technology, like NeoDen IN8C reflow equipment, can optimize temperature control and enhance bonding performance, guarantee stable and efficient production processes.
Post time: Oct-05-2024