In the actual mounting process of the surface mount machine, there will be many reasons that affect the mounting speed of the SMT machine. In order to reasonably improve the mounting speed, these factors can be rationalized and improved. Next, I will give you a simple analysis of the factors affecting the mounting speed of pick and place machine:
- Alternate waiting time of the mounting head of PNP machine.
- Component recognition time: refers to the time when the camera shoots the image of the component when the component identifies the camera through the component.
- SMT Nozzle replacement time: because there are various components on the printed circuit board, need different nozzle, SMT nozzle on the installation head often can not suck away all types of components, so the general SMT design has the function of automatic replacement of nozzle.
- Circuit board transfer and positioning time: the installed circuit board of the mounting machine is transferred from the workbench to the lower machine or the waiting position, and the waiting circuit board is transferred from the upper machine or the waiting position to the machine workbench. Transmission practice generally needs 2.5~5s, some special devices can reach 1.4s.
- worktable movement time: refers to the time of X, Y table to drive the printed circuit board from the original position to the current installation position. For platform machines, it refers to the time of the cantilever XY drive shaft to drive the placement head from the previous position to the current placement position.
- Component placement time: SMT nozzle component to install nozzle at the top of the cushion by Z axis driver to the height of the patch, and contact with the placement machine SMT solder paste on the vacuum nozzle cushion close and leave the height of the patch, blowing open the suction nozzle, to ensure that the component does not use suction nozzle to leave of time, and the time needed for the SMT nozzle to return to the original height.
- Correction time of reference point of circuit board: due to the transmission of circuit board, warping of circuit board of mount machine and the requirements of installation precision, it is a better method to use reference point positioning on circuit board. In general, a reference point can only correct the circuit board in the X and Y direction of deviation: two reference points can correct the circuit board in the X and Y direction of deviation and Angle deviation; The three reference points can correct the deviation and Angle deviation of the circuit board in the X and Y directions as well as the warpage caused by the backflow of the single-sided double-deck plate.
- Feeding and feeding time of components: under normal circumstances, the components should be in place before feeding, but in the same material level of continuous feeding, if the feeding time of the next material level is longer than the feeding time of the replacement of another feeding shaft, the mounting head of the mount machine needs to wait for the feeding time of the components. The suction time of the component includes the height time required for nozzle to move to the top of the component, SMT nozzle to be driven to the suction position of the component by the Z axis, the vacuum of the suction nozzle to be opened, and SMT nozzle to move the component back to the height required by the Z axis drive.
Post time: Feb-05-2021