DIP Wave Soldering Machine Process Flow

1. Plug-in

There are AI automatic plug-in machine, but also manual plug-in, mainly some high, large points, the need for through-hole capacitors, resistors, inductors

2. Wave soldering machine

After the completion of the plug-in, the need to go through the wave soldering, through-hole components fixed

3. Spot glue

Some large capacitors or easy to loosen, but also need to spot glue fixed

4. Cutting corners and cleaning of sub-board

Wave soldering after the component pins are relatively long, you need to cut the corners of the surface repair, and then split the board cleaning

5. Testing

After the completion of the sub-board, a PCBA board is born, it needs to be tested for functionality, testing can be delivered to the party or into the group packaging process.

NeoDen Wave Soldering Machine

Model: ND 200

Wave: Duble Wave

PCB Width: Max250mm

Tin tank capacity: 180-200KG

Preheating: 450mm

Wave Height: 12mm

PCB Conveyor Height (mm): 750±20mm

Startup Power: 9KW

Operation Power: 2KW

Tin Tank Power: 6KW

Preheating Power: 2KW

Motor Power: 0.25KW

Control Method: Touch Screen

Machine size: 1400*1200*1500mm

Packing size: 2200*1200*1600mm

Transfer speed: 0-1.2m/min 

Preheating Zones: Room temperature-180℃

Heating Method: Hot Wind

Cooling Zone: 1

Cooling method: Axial fan

Solder temperature: Room Temperature—300℃

Transfer Direction: Left→Right

Temperature Control: PID+SSR

Machine Control: Mitsubishi PLC+ Touch Screen

Flux tank capacity: Max 5.2L

Spray Method: Step Motor+ST-6

Power: 3 phase 380V  50HZ

Air source: 4-7KG/CM2, 12.5L/Min

Weight: 350KG

ND2+N8+AOI+IN12C


Post time: Jul-08-2022

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